Abstract: A thin film integrated circuit which is mass produced at low cost and a method for manufacturing a thin film integrated circuit according to the invention includes the steps of: forming a peel-off layer over a substrate; forming a base film over the peel-off layer; forming a plurality of thin film integrated circuits over the base film; forming a groove at the boundary between the plurality of thin film integrated circuits; and introducing a gas or a liquid containing halogen fluoride into the groove, thereby removing the peel-off layer; thus, the plurality of thin film integrated circuits are separated from each other.

Abstract: A safe method of manufacturing an electrode of a power storage device even when an alkali metal is used in forming the electrode. A negative electrode is manufactured by forming an alkali metal ion insertion/extraction layer which is a layer capable of alkali metal ion insertion and extraction on a surface of a current collector, forming an alkali metal film under reduced pressure on a surface of the alkali metal ion insertion/extraction layer, ionizing the alkali metal film, and impregnating the alkali metal ion insertion/extraction layer with the ionized alkali metal.

Abstract: To provide a thin film integrated circuit which is mass produced at low cost, a method for manufacturing a thin film integrated circuit according to the invention includes the steps of: forming a peel-off layer over a substrate; forming a base film over the peel-off layer; forming a plurality of thin film integrated circuits over the base film; forming a groove at the boundary between the plurality of thin film integrated circuits; and introducing a gas or a liquid containing halogen fluoride into the groove, thereby removing the peel-off layer; thus, the plurality of thin film integrated circuits are separated from each other.

Abstract: To provide a thin film integrated circuit which is mass produced at low cost, a method for manufacturing a thin film integrated circuit according to the invention includes the steps of: forming a peel-off layer over a substrate; forming a base film over the peel-off layer; forming a plurality of thin film integrated circuits over the base film; forming a groove at the boundary between the plurality of thin film integrated circuits; and introducing a gas or a liquid containing halogen fluoride into the groove, thereby removing the peel-off layer; thus, the plurality of thin film integrated circuits are separated from each other.

Abstract: It is an object of the present invention to provide a biological information detection sensor system which can be easily replaced. The present invention relates to a biological information detection sensor system having an adhesive tape including an adhesive surface which is provided with an adhesive material and a surface which is not provided with the adhesive material; a biological information detection sensor having an ID tag in which personal information is stored and a sensor, which is attached to an adhesive surface side of the adhesive tape; and an antenna which is connected to the biological information detection sensor and is pulled from the adhesive surface of the adhesive tape to the surface thereof through a groove provided in the adhesive tape. Accordingly, even if the biological information detection sensor gets dirty, it can be replaced to a new one soon, thereby being sanitary.

Abstract: To provide a thin film integrated circuit which is mass produced at low cost, a method for manufacturing a thin film integrated circuit according to the invention includes the steps of: forming a peel-off layer over a substrate; forming a base film over the peel-off layer, forming a plurality of thin film integrated circuits over the base film; forming a groove at the boundary between the plurality of thin film integrated circuits; and introducing a gas or a liquid containing halogen fluoride into the groove, thereby removing the peel-off layer; thus, the plurality of thin film integrated circuits are separated from each other.