Patents by Inventor Mii Matsuzawa

Mii Matsuzawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Au-based clad composite material, producing method thereof and micromotor using the same
    Patent number: 6514630
    Abstract: To provide a contact material suitable for a commutator of a micromotor which can improve wear resistance and prolong the life of the micromotor by improving an Au-based clad composite material provided at an outermost layer with Au or an Au alloy. The present invention provides the Au-based clad composite material including a surface of a contact substrate having an Ag—Cu—Si alloy layer cladded with Au or the Au alloy, wherein an intermetallic compound Cu—Si is dispersed and deposited in Au or the Au alloy.
    Type: Grant
    Filed: June 21, 2001
    Date of Patent: February 4, 2003
    Assignees: Sankyo Seiki Mfg. Co., Ltd., Tanaka Kikinzoku Kogyo K.K.
    Inventors: Mii Matsuzawa, Hirotaka Sakamaki, Osamu Matsuzawa
  • Au-based clad composite material, producing method thereof and micromotor using the same
    Publication number: 20020018910
    Abstract: To provide a contact material suitable for a commutator of a micromotor which can improve wear resistance and prolong the life of the micromotor by improving an Au-based clad composite material provided at an outermost layer with Au or an Au alloy. The present invention provides the Au-based clad composite material including a surface of a contact substrate having an Ag—Cu—Si alloy layer cladded with Au or the Au alloy, wherein an intermetallic compound Cu—Si is dispersed and deposited in Au or the Au alloy.
    Type: Application
    Filed: June 21, 2001
    Publication date: February 14, 2002
    Applicant: Sankyo Seiki Mfg. Co., Ltd.
    Inventors: Mii Matsuzawa, Hirotaka Sakamaki, Osamu Matsuzawa