Abstract: A pore-filled ion exchange polyelectrolyte composite membrane from which the surface ion exchange polyelectrolyte has been removed and a method of manufacturing the same are provided. The ion exchange polyelectrolyte composite membrane exhibits low film resistance and low in-plane-direction swelling degree, and has a smaller film-thickness than a commercial film, and thus, can be used for various purposes. In addition, since the pore-filled ion exchange polyelectrolyte composite membrane is continuously manufactured through a roll-to-roll process, the manufacturing process is simple, and manufacturing costs can be greatly reduced.

Abstract: Provided is a peptide composition for preventing or treating Alzheimer's dementia. A peptide or a salt substituent thereof according to the presently claimed subject matter exhibits effects such as suppression of LPS-mediated cytokine production, suppression of LPS-induced neuroinflammation, amelioration of cognitive impairment, suppression of beta amyloid or tau protein aggregation, and suppression of neuronal loss. The polypeptide or the salt substituent thereof can permeate the blood-brain barrier, and thus, is expected to be usefully used for preventing or treating Alzheimer's dementia.

Abstract: A semiconductor memory device and method thereof are provided. The example semiconductor memory device may include a first processor configured to exchange data with a first data length format, a second processor configured to exchange data with a second data length format and a shared memory configured to store data, the shared memory being shared by the first and second processors, the shared memory further configured to receive a read command from at least one of the first and second processors and to output data in response to the read command based on which of the first and second data length formats is used by the processor issuing the read command.

Abstract: A multipath accessible semiconductor memory device provides an interface function between processors. The memory device may include a memory cell array having a shared memory area operationally coupled to two or more ports that are independently accessible by two or more processors, an access path forming unit to form a data access path between one of the ports and the shared memory area in response to external signals applied by the processors, and an interface unit having a semaphore area and mailbox areas accessible in the shared memory area by the two or more processors to provide an interface function for communication between the two or more processors.

Abstract: Embodiments of the invention provide a semiconductor chip and a semiconductor chip package comprising a semiconductor chip. In one embodiment, the invention provides a semiconductor chip comprising a memory cell array, a control circuit, and a chip selection signal generating circuit electrically connected to first and second option pads. In the semiconductor chip, the chip selection signal generating circuit is enabled in accordance with a dual chip enable signal, and the control circuit is enabled and disabled in accordance with the chip selection signal received from the chip selection signal generating circuit. In addition, the chip selection signal generating circuit is adapted to generate a chip selection signal in accordance with signals received through the first and second option pads, respectively.

Abstract: A semiconductor memory device and method thereof are provided. The example semiconductor memory device may include a first processor configured to exchange data with a first data length format, a second processor configured to exchange data with a second data length format and a shared memory configured to store data, the shared memory being shared by the first and second processors, the shared memory further configured to receive a read command from at least one of the first and second processors and to output data in response to the read command based on which of the first and second data length formats is used by the processor issuing the read command.

Abstract: A multipath accessible semiconductor memory device provides an interface function between processors. The memory device may include a memory cell array having a shared memory area operationally coupled to two or more ports that are independently accessible by two or more processors, an access path forming unit to form a data access path between one of the ports and the shared memory area in response to external signals applied by the processors, and an interface unit having a semaphore area and mailbox areas accessible in the shared memory area by the two or more processors to provide an interface function for communication between the two or more processors.

Abstract: Embodiments of the invention provide a semiconductor chip and a semiconductor chip package comprising a semiconductor chip. In one embodiment, the invention provides a semiconductor chip comprising a memory cell array, a control circuit, and a chip selection signal generating circuit electrically connected to first and second option pads. In the semiconductor chip, the chip selection signal generating circuit is enabled in accordance with a dual chip enable signal, and the control circuit is enabled and disabled in accordance with the chip selection signal received from the chip selection signal generating circuit. In addition, the chip selection signal generating circuit is adapted to generate a chip selection signal in accordance with signals received through the first and second option pads, respectively.

Abstract: A level shifter circuit and method thereof are provided. The example level shifter circuit may include a pull-up drive unit driving an output node from a first voltage to a second voltage in response to an input signal, a target voltage for the second voltage higher than a target voltage for the first voltage and the input signal based on the first voltage and a third voltage and a pull-down drive unit driving the output node to the third voltage in response to the input signal, the pull-up and pull-down drive units adjusting current levels of at least one of a pull-up current flowing through the pull-up drive unit and a pull-down current flowing through the pull-down drive unit based on whether the pull-up drive unit and the pull-down drive unit are operating concurrently.

Abstract: A semiconductor device includes a memory and a power voltage interrupter configured to interrupt an external power voltage applied to circuitry of the semiconductor device responsive to a Deep Power Down (DPD) command signal generated in a DPD mode of the memory. A power voltage shifter is configured to shift a power voltage in the circuitry to a specific level responsive to the DPD command signal.

Abstract: A semiconductor device includes a memory and a power voltage interrupter configured to interrupt an external power voltage applied to circuitry of the semiconductor device responsive to a Deep Power Down (DPD) command signal generated in a DPD mode of the memory. A power voltage shifter is configured to shift a power voltage in the circuitry to a specific level responsive to the DPD command signal.