Patents by Inventor Mik Suekawa

Mik Suekawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Assembly for toolless installation and locking of a printed circuit carrier to a system
    Patent number: 6999321
    Abstract: A lock assembly for securing a printed circuit assembly to a housing comprises a pivot point for coupling the lock assembly to the housing and a lock member capable of rotating and snapping into a detent in the printed circuit assembly to hold the printed circuit assembly in place.
    Type: Grant
    Filed: November 25, 2003
    Date of Patent: February 14, 2006
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Mik Suekawa, Kwang Kim, Bradley D. Blackwood, Robert Jetter, Damon Campbell
  • Assembly for toolless installation and locking of a printed circuit carrier to a system
    Publication number: 20050111201
    Abstract: A lock assembly for securing a printed circuit assembly to a housing comprises a pivot point for coupling the lock assembly to the housing and a lock member capable of rotating and snapping into a detent in the printed circuit assembly to hold the printed circuit assembly in place.
    Type: Application
    Filed: November 25, 2003
    Publication date: May 26, 2005
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Mik Suekawa, Kwang Kim, Bradley Blackwood, Robert Jetter, Damon Campbell