Abstract: According to one embodiment, a semiconductor wafer is formed with a plurality of first regions each provided with a circuit element and a second region between the first regions. The semiconductor wafer includes a first structure in which a first embedding material is embedded in a first recess extending in a first direction perpendicular to a surface of a substrate. The first structure is between edges of the first regions and a third region that is cut in the second region when the first regions are separated.

Abstract: According to one embodiment, a semiconductor wafer is formed with a plurality of first regions each provided with a circuit element and a second region between the first regions. The semiconductor wafer includes a first structure in which a first embedding material is embedded in a first recess extending in a first direction perpendicular to a surface of a substrate. The first structure is between edges of the first regions and a third region that is cut in the second region when the first regions are separated.

Abstract: According to one embodiment, a semiconductor wafer is formed with a plurality of first regions each provided with a circuit element and a second region between the first regions. The semiconductor wafer includes a first structure in which a first embedding material is embedded in a first recess extending in a first direction perpendicular to a surface of a substrate. The first structure is between edges of the first regions and a third region that is cut in the second region when the first regions are separated.

Abstract: According to one embodiment, a semiconductor wafer includes a plurality of chip regions, a plurality of chip regions, a device layer, a first structure, and a second structure. The device layer includes an integrated circuit formed in each of the chip regions. The first structure is formed in the kerf region by filling a first cavity with a first filling material. The first cavity extends vertically with respect to a surface of a semiconductor substrate. The second structure is formed in the device layer by filling a second cavity with a second filling material. The second cavity extends vertically with respect to the surface of the semiconductor substrate.

Abstract: According to one embodiment, a semiconductor wafer is formed with a plurality of first regions each provided with a circuit element and a second region between the first regions. The semiconductor wafer includes a first structure in which a first embedding material is embedded in a first recess extending in a first direction perpendicular to a surface of a substrate. The first structure is between edges of the first regions and a third region that is cut in the second region when the first regions are separated.

Abstract: According to one embodiment, a semiconductor wafer includes a plurality of chip regions, a plurality of chip regions, a device layer, a first structure, and a second structure. The device layer includes an integrated circuit formed in each of the chip regions. The first structure is formed in the kerf region by filling a first cavity with a first filling material. The first cavity extends vertically with respect to a surface of a semiconductor substrate. The second structure is formed in the device layer by filling a second cavity with a second filling material. The second cavity extends vertically with respect to the surface of the semiconductor substrate.

Abstract: According to one embodiment, a method of manufacturing a semiconductor device includes: bonding a first surface of a device substrate on which a device is formed on a first surface to a support substrate via an adhesive; after bonding the device substrate to the support substrate, grinding and thinning a second surface side opposite to the first surface of the device substrate based on an in-plane processing rate at the time of forming a semiconductor substrate by RIE; after thinning the device substrate, forming a hole penetrating the device substrate by RIE; and burying metal in the hole to forma through electrode.

Abstract: According to one embodiment, a method of manufacturing a semiconductor device includes: bonding a first surface of a device substrate on which a device is formed on a first surface to a support substrate via an adhesive; after bonding the device substrate to the support substrate, grinding and thinning a second surface side opposite to the first surface of the device substrate based on an in-plane processing rate at the time of forming a semiconductor substrate by RIE; after thinning the device substrate, forming a hole penetrating the device substrate by RIE; and burying metal in the hole to forma through electrode.

Abstract: According to one embodiment, a method for fabricating a semiconductor device is provided. The method for fabricating the semiconductor device includes three steps of a providing step, a bonding step, and a thinning step. In the providing step, a mitigation layer that mitigates warping of the device substrate being thinned by grinding is provided on the supporting substrate. In the bonding step, the device substrate is bonded to the supporting substrate on which the mitigation layer is provided. In the thinning step, the device substrate supported by the supporting substrate is thinned by grinding.

Abstract: According to one embodiment, a method of manufacturing a semiconductor device includes forming an overhanging portion in a perimeter region of a front surface side of a wafer provided with a semiconductor element on the front surface thereof by removing a portion of the wafer in perimeter region of the wafer from the front surface side of the wafer, bonding the front surface of the wafer to a supporting substrate, and thinning the wafer to less than 200 ?m in thickness by grinding the wafer from a rear surface side thereof.

Abstract: According to one embodiment, a method for fabricating a semiconductor device is provided. The method for fabricating the semiconductor device includes three steps of a providing step, a bonding step, and a thinning step. In the providing step, a mitigation layer that mitigates warping of the device substrate being thinned by grinding is provided on the supporting substrate. In the bonding step, the device substrate is bonded to the supporting substrate on which the mitigation layer is provided. In the thinning step, the device substrate supported by the supporting substrate is thinned by grinding.

Abstract: According to one embodiment, an optical waveguide sensor chip includes an optical waveguide layer; a pair of optical elements disposed at both ends of the optical waveguide layer so that light enters the optical waveguide layer and the light exits from the optical waveguide layer; a functional film formed on a predetermined region of the optical waveguide layer; a covering layer formed in a planar region on the light entrance surface of the optical waveguide layer, in which at least the optical elements are disposed; a first through hole configured to allow the light entering the entrance-side optical element to pass therethrough; and a second through hole configured to allow the light exiting from the exit-side optical element to pass therethrough.

Abstract: A foldable portable information terminal includes an upper unit having a display unit on its one side, a lower unit having operation keys on its one side, and a movable connecting mechanism connecting the upper unit and the lower unit allowing the upper unit to be opened, closed, and freely rotated with respect to a longitudinal direction of the lower unit. The displaying mode of the display unit whose direction varies depending on a position of the upper unit is changed depending on a positional relationship of the upper unit and the lower unit.

Abstract: Portable information terminal equipment having a function to perform the informing process at the time of reception in cooperation with a connecting section driving mechanism as well as a function to enable the open/close movement of the upper and lower units through one-touch operation making use of the connecting section driving mechanism. Depending on informing modes, a motor drive circuit drives a motor under the control of a controller on receipt of a call or a message to apply a driving force to the open/close mechanism of a hinge unit. Thereby, the portable information terminal equipment is folded/unfolded, that is, the posture of the portable information terminal equipment is changed, and a user is informed of the receipt of the call or the message.

Abstract: Portable information terminal equipment having a function to perform the informing process at the time of reception in cooperation with a connecting section driving mechanism as well as a function to enable the open/close movement of the upper and lower units through one-touch operation making use of the connecting section driving mechanism. Depending on informing modes, a motor drive circuit drives a motor under the control of a controller on receipt of a call or a message to apply a driving force to the open/close mechanism of a hinge unit. Thereby, the portable information terminal equipment is folded/unfolded, that is, the posture of the portable information terminal equipment is changed, and a user is informed of the receipt of the call or the message.

Abstract: According to one embodiment, an optical waveguide sensor chip includes an optical waveguide layer; a pair of optical elements disposed at both ends of the optical waveguide layer so that light enters the optical waveguide layer and the light exits from the optical waveguide layer; a functional film formed on a predetermined region of the optical waveguide layer; a covering layer formed in a planar region on the light entrance surface of the optical waveguide layer, in which at least the optical elements are disposed; a first through hole configured to allow the light entering the entrance-side optical element to pass therethrough; and a second through hole configured to allow the light exiting from the exit-side optical element to pass therethrough.

Abstract: A portable device includes an upper unit, a lower unit having an operation section on an operation surface, and a movable connecting mechanism which connects the upper unit and the lower unit. The movable connecting mechanism includes a rotating hinge including a rotation axis which is securely and rotatably provided to the lower unit and which protrudes from the operation surface in a direction substantially normal to the operation surface, a projection protruding outward from the rotation axis, and a stopping member provided at a location where the projection comes in contact with the stopping member due to rotation of the rotation axis. The stopping member is movable within a predetermined range of movement due to the projection coming in contact with the stopping member.

Abstract: Portable information terminal equipment having a function to perform the informing process at the time of reception in cooperation with a connecting section driving mechanism as well as a function to enable the open/close movement of the upper and lower units through one-touch operation making use of the connecting section driving mechanism. Depending on informing modes, a motor drive circuit drives a motor under the control of a controller on receipt of a call or a message to apply a driving force to the open/close mechanism of a hinge unit. Thereby, the portable information terminal equipment is folded/unfolded, that is, the posture of the portable information terminal equipment is changed, and a user is informed of the receipt of the call or the message. Besides, the portable information terminal equipment performs conventional informing processes, such as ringing, light emitting, message or image display and the like, in combination with the open/close or rotative operation.

Abstract: According to one embodiment, an optical element includes: a substrate in which a through-hole is formed; a transparent thin film formed on at least one of the rear surface and the front surface of the substrate to cover the through-hole; and a lens formed in contact with the surface of the thin film in an area where the thin film covers the through-hole.

Abstract: A portable device includes an upper unit, a lower unit having an operation section on an operation surface, and a movable connecting mechanism which connects the upper unit and the lower unit. The movable connecting mechanism includes a rotating hinge including a rotation axis which is securely and rotatably provided to the lower unit and which protrudes from the operation surface in a direction substantially normal to the operation surface, a projection protruding outward from the rotation axis, and a stopping member provided at a location where the projection comes in contact with the stopping member due to rotation of the rotation axis. The stopping member is movable within a predetermined range of movement due to the projection coming in contact with the stopping member.