Patents by Inventor Mika Kagawa

Mika Kagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • THERMALLY-CONDUCTIVE RESIN COMPOSITION AND MOLDED ARTICLE
    Publication number: 20240010900
    Abstract: Provided is a thermally-conductive resin composition containing a thermosetting resin and boron nitride particles, in which, in a case where a void fraction of the boron nitride particles relative to a compression pressure is measured, a void fraction at a compression pressure of 4 MPa is 30% or more and 60% or less, and a void fraction at a pressure of 8 MPa is 20% or more and 50% or less.
    Type: Application
    Filed: December 1, 2021
    Publication date: January 11, 2024
    Applicant: SUMITOMO BAKELITE CO., LTD.
    Inventor: Mika Kagawa
  • THERMALLY CONDUCTIVE SHEET WITH METAL PLATE AND METHOD OF PRODUCING THERMALLY CONDUCTIVE SHEET
    Publication number: 20230150243
    Abstract: There is provided a thermally conductive sheet with a metal plate including: a metal plate; and a thermally conductive sheet laminated on the metal plate and containing a thermosetting resin and boron nitride particles, in which an average particle size of the boron nitride particles is 10 ?m or more and 100 ?m or less, and an amount of warpage of the thermally conductive sheet when the metal plate is removed is 0.15 mm or more and 1.30 mm or less.
    Type: Application
    Filed: May 17, 2021
    Publication date: May 18, 2023
    Applicant: SUMITOMO BAKELITE CO., LTD.
    Inventor: Mika Kagawa