Abstract: A high-molecular-weight compound having at least one substituted triarylamine structural unit represented by the following general formula (1), further including a structural unit having at least one aromatic hydrocarbon ring or a structural unit having a triarylamine skeleton in addition to the at least one substituted triarylamine structural unit, and having a weight average molecular weight of 10,000 or more and 1,000,000 or less in terms of polystyrene and no a crosslinker, wherein the high-molecular-weight compound is used in an organic EL device as a constituent material of at least one organic layer. A polymer material having excellent hole injection/transport performance, electron blocking capability, high heat resistance, and high stability in a thin-film state for use in a polymer organic EL device, and an organic EL device having a low drive voltage, high light emission efficiency, and a long lifetime using this polymer material.

Abstract: A semiconductor light-emitting device and a method for manufacturing the same can include a wavelength converting layer located on at least one semiconductor light-emitting chip in order to emit various colored lights including white light. The semiconductor light-emitting device can include a casing having a cavity and a mounting surface, the chip mounted on the mounting surface, a transparent plate mounted on the wavelength converting layer within a top surface of the chip and a reflective layer located in the cavity so as to surround the transparent plate, the wavelength converting layer and the chip. The semiconductor light-emitting device can be configured to improve light-colored variability and light-emitting efficiency of the chip by using the reflective layer as a reflector, and therefore can emit a wavelength-converted light having a substantially uniform color tone and a high light-emitting efficiency from a smaller light-emitting surface than the top surface of the chip.

Abstract: A semiconductor light emitting device can be configured to maintain high luminance and to suppress the possibility of the occurrence of wire breakage with high quality and reliability. A method for producing such a semiconductor light emitting device with a high process yield is also disclosed. The semiconductor light emitting device can include a sealing member into which a reflective filler can be mixed in such an amount (concentration) range that luminous flux with a predetermined amount can be maintained and the possibility of the occurrence of wire breakage can be lowered. Various sealing members containing a reflective filler with a plurality of concentrations within this range can be prepared in advance.

Abstract: A semiconductor light-emitting device and a method for manufacturing the same can include a mixture resin encapsulating an LED chip in order to emit various colored lights, and can also include a separate transparent resin. The semiconductor light-emitting device can include a supporting plate, a base board located on the supporting plate, an upper base board located on the base board via an insulating adhesive layer, and an LED chip mounted on the supporting plate and located in a cavity composed of through-bores in the base boards. The transparent resin can be disposed circularly around an end of the insulating adhesive layer so as not to generate bubbles therein. The mixture resin can be disposed in the cavity except for that portion in which the transparent resin is located. Thus, the device can be configured to easily detect bubbles with a visual examination even if/when the bubbles are caused in the transparent resin. The disclosed device and method can prevent defective products from going to market.