Patents by Inventor Mika NIWAKI

Mika NIWAKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Quantum-dot containing resin sheet or film, method for producing the same, and wavelength conversion member
    Patent number: 11905443
    Abstract: To provide a quantum dot-containing resin sheet or film, a method for producing the same, and a wavelength conversion member that can, in particular, solve the problem of aggregation of the quantum dots and the problem with the use of a scattering agent, suppress a decrease in light conversion efficiency, and improve the light conversion efficiency of a resin molded product containing quantum dots. The quantum dot-containing resin sheet or film of the present invention includes a stack of a plurality of resin layers, at least one of the resin layers containing quantum dots, and the plurality of resin layers is integrally molded through co-extrusion.
    Type: Grant
    Filed: March 1, 2023
    Date of Patent: February 20, 2024
    Assignee: NS MATERIALS INC.
    Inventors: Kazunori Iida, Emi Tsutsumi, Mika Niwaki, Jun Kaneno, Soichiro Nikata, Hidetoshi Tanaka
  • QUANTUM-DOT CONTAINING RESIN SHEET OR FILM, METHOD FOR PRODUCING THE SAME,AND WAVELENGTH CONVERSION MEMBER
    Publication number: 20230203366
    Abstract: To provide a quantum dot-containing resin sheet or film, a method for producing the same, and a wavelength conversion member that can, in particular, solve the problem of aggregation of the quantum dots and the problem with the use of a scattering agent, suppress a decrease in light conversion efficiency, and improve the light conversion efficiency of a resin molded product containing quantum dots. The quantum dot-containing resin sheet or film of the present invention includes a stack of a plurality of resin layers, at least one of the resin layers containing quantum dots, and the plurality of resin layers is integrally molded through co-extrusion.
    Type: Application
    Filed: March 1, 2023
    Publication date: June 29, 2023
    Applicant: NS MATERIALS INC.
    Inventors: Kazunori IIDA, Emi TSUTSUMI, Mika NIWAKI, Jun KANENO, Soichiro NIKATA, Hidetoshi TANAKA
  • Quantum-dot containing resin sheet or film, method for producing the same, and wavelength conversion member
    Patent number: 11629288
    Abstract: To provide a quantum dot-containing resin sheet or film, a method for producing the same, and a wavelength conversion member that can, in particular, solve the problem of aggregation of the quantum dots and the problem with the use of a scattering agent, suppress a decrease in light conversion efficiency, and improve the light conversion efficiency of a resin molded product containing quantum dots. The quantum dot-containing resin sheet or film of the present invention includes a stack of a plurality of resin layers, at least one of the resin layers containing quantum dots, and the plurality of resin layers is integrally molded through co-extrusion.
    Type: Grant
    Filed: October 15, 2018
    Date of Patent: April 18, 2023
    Assignee: NS MATERIALS INC.
    Inventors: Kazunori Iida, Emi Tsutsumi, Mika Niwaki, Jun Kaneno, Soichiro Nikata, Hidetoshi Tanaka
  • QUANTUM-DOT CONTAINING RESIN SHEET OR FILM, METHOD FOR PRODUCING THE SAME, AND WAVELENGTH CONVERSION MEMBER
    Publication number: 20210189230
    Abstract: To provide a quantum dot-containing resin sheet or film, a method for producing the same, and a wavelength conversion member that can, in particular, solve the problem of aggregation of the quantum dots and the problem with the use of a scattering agent, suppress a decrease in light conversion efficiency, and improve the light conversion efficiency of a resin molded product containing quantum dots. The quantum dot-containing resin sheet or film of the present invention includes a stack of a plurality of resin layers, at least one of the resin layers containing quantum dots, and the plurality of resin layers is integrally molded through co-extrusion.
    Type: Application
    Filed: October 15, 2018
    Publication date: June 24, 2021
    Applicant: NS MATERIALS Inc.
    Inventors: Kazunori IIDA, Emi TSUTSUMI, Mika NIWAKI, Jun KANENO, Soichiro NIKATA, Hidetoshi TANAKA