Patents by Inventor Mika SAKAMOTO

Mika SAKAMOTO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • COMPOSITION FOR AMELIORATING SKIN TISSUE ABNORMALITY
    Publication number: 20240216397
    Abstract: The present disclosure provides a composition for ameliorating a skin tissue abnormality comprising a compound of formula (I) or an ester, oxide, pharmaceutically acceptable salt or solvate thereof.
    Type: Application
    Filed: April 27, 2022
    Publication date: July 4, 2024
    Applicant: Kyoto University
    Inventors: Akira KAKIZUKA, Tomoki YOSHIDA, Kenji KABASHIMA, Rintaro SHIBUYA, Mika SAKAMOTO
  • Method for manufacturing semiconductor device and surface protective tape
    Patent number: 8444799
    Abstract: A method for manufacturing a semiconductor device includes adhering an adhesive layer of a surface protective tape including a base material film, an intermediate layer disposed on the base material film, and the adhesive layer disposed on the intermediate layer to one surface of a semiconductor substrate; curing the intermediate layer while a flat plate is pressed against the base material film of the surface protective tape; grinding the other surface of the semiconductor substrate; curing the adhesive layer; and separating the surface protective tape from the semiconductor substrate.
    Type: Grant
    Filed: September 2, 2010
    Date of Patent: May 21, 2013
    Assignee: Fujitsu Semiconductor Limited
    Inventors: Hironori Fukaya, Yuzo Shimobeppu, Kazuhiro Yoshimoto, Kazuo Teshirogi, Kazuyuki Uragou, Mika Sakamoto, Masaya Tazawa
  • Method of manufacturing semiconductor device with spraying fluid
    Patent number: 8440545
    Abstract: A method of manufacturing a semiconductor device includes spraying fluid onto a surface of a treatment target substrate including a semiconductor substrate; forming a protection layer on the surface of the treatment target substrate after spraying the fluid; selectively removing the protection layer and a part of the treatment target substrate by an energy beam; and conducting removal processing on an area of the treatment target substrate from which the protection layer and the part of the treatment target substrate are selectively removed.
    Type: Grant
    Filed: November 18, 2008
    Date of Patent: May 14, 2013
    Assignee: Fujitsu Semiconductor Limited
    Inventors: Hironori Fukaya, Yuzo Shimobeppu, Kazuhiro Yoshimoto, Yoshiaki Shinjo, Kazuo Teshirogi, Mika Sakamoto
  • METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SURFACE PROTECTIVE TAPE
    Publication number: 20110048615
    Abstract: A method for manufacturing a semiconductor device includes adhering an adhesive layer of a surface protective tape including a base material film, an intermediate layer disposed on the base material film, and the adhesive layer disposed on the intermediate layer to one surface of a semiconductor substrate; curing the intermediate layer while a flat plate is pressed against the base material film of the surface protective tape; grinding the other surface of the semiconductor substrate; curing the adhesive layer; and separating the surface protective tape from the semiconductor substrate.
    Type: Application
    Filed: September 2, 2010
    Publication date: March 3, 2011
    Applicant: FUJITSU SEMICONDUCTOR LIMITED
    Inventors: Hironori Fukaya, Yuzo Shimobeppu, Kazuhiro Yoshimoto, Kazuo Teshirogi, Kazuyuki Uragou, Mika Sakamoto, Masaya Tazawa
  • METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
    Publication number: 20090239355
    Abstract: A method of manufacturing a semiconductor device includes spraying fluid onto a surface of a treatment target substrate including a semiconductor substrate; forming a protection layer on the surface of the treatment target substrate after spraying the fluid; selectively removing the protection layer and a part of the treatment target substrate by an energy beam; and conducting removal processing on an area of the treatment target substrate from which the protection layer and the part of the treatment target substrate are selectively removed.
    Type: Application
    Filed: November 18, 2008
    Publication date: September 24, 2009
    Applicant: FUJITSU MICROELECTRONICS LIMITED
    Inventors: Hironori FUKAYA, Yuzo SHIMOBEPPU, Kazuhiro YOSHIMOTO, Yoshiaki SHINJO, Kazuo TESHIROGI, Mika SAKAMOTO