Patents by Inventor Mika SAKO

Mika SAKO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250002727
    Abstract: The present invention provides an antimold emulsion coating material and an antimold fine particle dispersion which exhibit excellent antimold effects over an extended period even when exposed to a wet heat environment. The antimold emulsion coating material contains composite tungsten oxide fine particles whose surfaces are coated with a coating film containing at least one selected from hydrolysis products of metal chelate compounds, polymers of hydrolysis products of metal chelate compounds, hydrolysis products of metal cyclic oligomer compounds, and polymers of hydrolysis products of metal cyclic oligomer compounds (surface-treated composite tungsten oxide fine particles), and a resin emulsion.
    Type: Application
    Filed: June 20, 2022
    Publication date: January 2, 2025
    Applicant: SUMITOMO METAL MINING Co., Ltd.
    Inventors: Akinari NOSHITA, Mika SAKO, Takeshi CHONAN
  • Publication number: 20240045124
    Abstract: Provided is a laminated structure for solar radiation shielding, including: two laminated plates selected from glass plates and plate-shaped plastics; and an intermediate layer provided between the two laminated plates, wherein one or more members selected from the laminated plates and the intermediate layer contain solar radiation shielding function material particles, and the solar radiation shielding function material particles contain particles of a complex tungsten oxide represented by General Formula: MxWyOz (where an element M is one or more elements selected from H, He, alkali metals, alkaline-earth metals, rare-earth elements, Mg, Zr, Cr, Mn, Fe, Ru, Co, Rh, Ir, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Al, Ga, In, Tl, Si, Ge, Sn, Pb, Sb, B, F, P, S, Se, Br, Te, Ti, Nb, V, Mo, Ta, Re, Be, Hf, Os, Bi, and I, 0.001?x/y?1, and 3.0<z/y).
    Type: Application
    Filed: December 20, 2021
    Publication date: February 8, 2024
    Inventors: Mika SAKO, Takeshi CHONAN