Patents by Inventor Mika Sippola

Mika Sippola has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8692527
    Abstract: The invention relates to power supplies where the output current is controllable. In prior art, there is a problem to provide both high rate of change in the current output and high efficiency. The solution of the present invention is based on combining current elements, whereby the current is controlled by switching the outputs of the current elements. The current elements can be implemented with e.g. buck converters, whereby the power dissipation is small.
    Type: Grant
    Filed: September 4, 2008
    Date of Patent: April 8, 2014
    Assignee: Efore Oyj
    Inventors: Seppo Ritamäki, Mika Sippola
  • Publication number: 20100270990
    Abstract: The invention relates to power supplies where the output current is controllable. In prior art, there is a problem to provide both high rate of change in the current output and high efficiency. The solution of the present invention is based on combining current elements, whereby the current is controlled by switching the outputs of the current elements. The current elements can be implemented with e.g. buck converters, whereby the power dissipation is small.
    Type: Application
    Filed: September 4, 2008
    Publication date: October 28, 2010
    Applicant: EFORE OYJ
    Inventors: Seppo Ritamaki, Mika Sippola
  • Patent number: 7205655
    Abstract: The invention relates to the manufacturing of a multilayer structure and especially it relates to the manufacturing of a three-dimensional structure and its use as an electronics assembly substrate and as a winding for transformers and inductors. When a multilayer structure is manufactured by folding a conductor-insulator-conductor laminate, where the conductor layers to be separated from each other follow each other on opposite sides of the conductor-insulator-conductor laminate in the sections following each other and where the insulator has been removed from the places where the conductor layers are to be connected together after folding, it is possible to manufacture a wide range of three-dimensional multilayer structures where the volume occupied by the windings over the total volume can be maximized. Alternatively, by using the method it is also possible to manufacture a multilayer structure where components have been buried inside.
    Type: Grant
    Filed: March 23, 2004
    Date of Patent: April 17, 2007
    Assignee: Schaffner EMV AG
    Inventor: Mika Sippola
  • Patent number: 7116076
    Abstract: Filter network for the reduction of the voltage switching speed between an electrical motor drive and an electrical motor and/or between an electrical distribution network and a motor drive, comprising for each electrical phase a self-damped inductor having a complex impedance determined by a magnitude (Z) and a phase (?), the phase (?) of the complex impedance being comprised between 80 and 90 degrees in the frequency range of the motor's current, and being less than 60 degrees in the frequency range of the overvoltage oscillations. Using the inventive filter network, it is possible to manufacture low cost and small size du/dt-filters generating low voltage overshoot and low losses.
    Type: Grant
    Filed: July 13, 2005
    Date of Patent: October 3, 2006
    Assignee: Schaffner EMV AG
    Inventors: Mika Sippola, Peter Kull-Bucher
  • Publication number: 20050275368
    Abstract: Filter network for the reduction of the voltage switching speed between an electrical motor drive and an electrical motor and/or between an electrical distribution network and a motor drive, comprising for each electrical phase a self-damped inductor having a complex impedance determined by a magnitude (Z) and a phase (?), the phase (?) of the complex impedance being comprised between 80 and 90 degrees in the frequency range of the motor's current, and being less than 60 degrees in the frequency range of the overvoltage oscillations. Using the inventive filter network, it is possible to manufacture low cost and small size du/dt-filters generating low voltage overshoot and low losses.
    Type: Application
    Filed: July 13, 2005
    Publication date: December 15, 2005
    Inventors: Mika Sippola, Peter Kull-Bucher
  • Publication number: 20050140487
    Abstract: An inductive component, such as a transformer, is made by applying conductive tracks onto a thin, foldable substrate (10) and then Z-folding the substrate so that the conductive tracks from a coil. A ferrite core is then placed through the coil. In order to maximise the current capacity of the transformer, there are electrical connections between leaves not only around each fold line (14) where the track traverses the fold line, but also between specially prepared areas X-X of the tracks which end up facing each other from adjacent folds once the substrate has been folded.
    Type: Application
    Filed: November 12, 2004
    Publication date: June 30, 2005
    Applicant: PROFEC TECHNOLOGIES OY
    Inventors: Mika Sippola, Kevin McGrane
  • Publication number: 20040178489
    Abstract: The invention relates to the manufacturing of a multilayer structure and especially it relates to the manufacturing of a three-dimensional structure and its use as an electronics assembly substrate and as a winding for transformers and inductors. When a multilayer structure is manufactured by folding a conductor-insulator-conductor laminate, where the conductor layers to be separated from each other follow each other on opposite sides of the conductor-insulator-conductor laminate in the sections following each other and where the insulator has been removed from the places where the conductor layers are to be connected together after folding, it is possible to manufacture a wide range of three-dimensional multilayer structures where the volume occupied by the windings over the total volume can be maximized. Alternatively, by using the method it is also possible to manufacture a multilayer structure where components have been buried inside.
    Type: Application
    Filed: March 23, 2004
    Publication date: September 16, 2004
    Inventor: Mika Sippola