Patents by Inventor Mika Takahara

Mika Takahara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR DEVICE, FABRICATION METHOD THEREOF, AND PHOTOMASK
    Publication number: 20100019241
    Abstract: There is provided a semiconductor device including a wafer and a focus monitoring pattern formed on the wafer. The focus monitoring pattern has at least one pair of first and second patterns. The first pattern has an unexposed region surrounded by an exposed region and the second pattern has an exposed region surrounded by an unexposed region. In addition, the present invention provides a method of fabricating a semiconductor device comprising the steps of forming at least one pair of first and second patterns on a wafer. The first pattern has an unexposed region surrounded by an exposed region and the second pattern has an exposed region surrounded by an unexposed region. The method further comprises checking a focusing condition on exposure by measuring widths of the first and second patterns formed on the wafer.
    Type: Application
    Filed: October 7, 2009
    Publication date: January 28, 2010
    Inventors: Mika TAKAHARA, Tohru HIGASHI, Shigehiro TOYODA
  • Semiconductor device, fabricating method thereof, and photomask
    Patent number: 7651826
    Abstract: There is provided a semiconductor device including a wafer and a focus monitoring pattern formed on the wafer. The focus monitoring pattern having at least one pair of first and second patterns, and the first pattern has an unexposed region surrounded by an exposed region, and the second pattern has an exposed region surrounded by an unexposed region. In addition, the present invention provides a method of fabricating a semiconductor device comprising the steps of forming at least one pair of first and second patterns on a wafer, the first pattern having an unexposed region surrounded by an exposed region, the second pattern having an exposed region surrounded by an unexposed region, and checking a focusing condition on exposure by measuring widths of the first and second patterns formed on the wafer.
    Type: Grant
    Filed: November 30, 2005
    Date of Patent: January 26, 2010
    Assignee: Spansion LLC
    Inventors: Mika Takahara, Tohru Higashi, Shigehiro Toyoda
  • Semiconductor device, fabricating method thereof, and photomask
    Publication number: 20060246359
    Abstract: There is provided a semiconductor device including a wafer and a focus monitoring pattern formed on the wafer. The focus monitoring pattern having at least one pair of first and second patterns, and the first pattern has an unexposed region surrounded by an exposed region, and the second pattern has an exposed region surrounded by an unexposed region. In addition, the present invention provides a method of fabricating a semiconductor device comprising the steps of forming at least one pair of first and second patterns on a wafer, the first pattern having an unexposed region surrounded by an exposed region, the second pattern having an exposed region surrounded by an unexposed region, and checking a focusing condition on exposure by measuring widths of the first and second patterns formed on the wafer.
    Type: Application
    Filed: November 30, 2005
    Publication date: November 2, 2006
    Inventors: Mika Takahara, Tohru Higashi, Shigehiro Toyoda