Abstract: An optical sub-assembly is disclosed, having a mating end adapted to receive a mating fiber, and a back end provided with a converging lens establishing an expanded beam interface with an optical device. The use of an expanded beam interface provides greatly improved stability, and reduces the sensitivity to slight misalignments The optical sub-assembly comprises a receptacle for which the manufacturer thereof has full control over the optical interfaces and refractive index boundaries. The receptacle and the optical device may be manufactured separately.

Abstract: An optical sub-assembly is disclosed, having a mating end adapted to receive a mating fiber, and a back end provided with a converging lens establishing an expanded beam interface with an optical device. The use of an expanded beam interface provides greatly improved stability, and reduces the sensitivity to slight misalignments The optical sub-assembly comprises a receptacle for which the manufacturer thereof has full control over the optical interfaces and refractive index boundaries. The receptacle and the optical device may be manufactured separately.

Abstract: A vertical cavity surface emitting laser (VCSEL) and monitoring diode combination having reduced parasitic capacitance for use in high bandwidth communications systems. The VCSEL has both p-type and n-type contacts on the same face. This allows the VCSEL to be mounted on a monitor chip or diode without using a metal contact layer. In an embodiment wherein the VCSEL is soldered to the monitor chip for mechanical stability only a small metal pad no larger than the VCSEL is used. The reduction in metallisation results in a lower parasitic capacitance that in turn results in higher potential operational speeds.

Abstract: The present invention provides a method and apparatus for hot-pluggable electronic component connection. In one embodiment of the present invention, ground and power line couplings with a system are formed by moving the component in one direction while signal line couplings with the system are formed by moving the component in another direction. In one embodiment, a guide rail system causes a hot-pluggable component to move in a direction which couples, first, the ground line and, then, the power lines to the system. After the ground and power lines are connected, the guide rail system causes the component to move in another direction which couples the signal lines to the system. In another embodiment, a latching mechanism holds the component in place once the signal lines are coupled to the system. In this embodiment, an ejection system releases the latching mechanism and allows removal of the component.

Abstract: A vertical cavity surface emitting laser (VCSEL) and monitoring diode combination having reduced parasitic capacitance for use in high bandwidth communications systems. The VCSEL has both p-type and n-type contacts on the same face. This allows the VCSEL to be mounted on a monitor chip or diode without using a metal contact layer. In an embodiment wherein the VCSEL is soldered to the monitor chip for mechanical stability only a small metal pad no larger than the VCSEL is used.

Abstract: The present invention provides a method and apparatus for hot-pluggable electronic component connection. In one embodiment of the present invention, ground and power line couplings with a system are formed by moving the component in one direction while signal line couplings with the system are formed by moving the component in another direction. In one embodiment, a guide rail system causes a hot-pluggable component to move in a direction which couples, first, the ground line and, then, the power lines to the system. After the ground and power lines are connected, the guide rail system causes the component to move in another direction which couples the signal lines to the system. In another embodiment, a latching mechanism holds the component in place once the signal lines are coupled to the system. In this embodiment, an ejection system releases the latching mechanism and allows removal of the component.

Abstract: A vertical cavity surface emitting laser (VCSEL) and monitoring diode combination having reduced parasitic capacitance for use in high bandwidth communications systems. The VCSEL has both p-type and n-type contacts on the same face. This allows the VCSEL to be mounted on a monitor chip or diode without using a metal contact layer. In an embodiment wherein the VCSEL is soldered to the monitor chip for mechanical stability only a small metal pad no larger than the VCSEL is used.

Abstract: A method of fabricating a semiconductor device having active components grown on a substrate, involves providing a semiconductor substrate on which the active components are grown, and doping the semiconductor substrate to render it non conductive and thereby reduce parasitic capacitance between active components thereon. The components typically comprise a VCSEL and monitor. The doped substrate reduces parasitic capacitance.