Patents by Inventor Mikako Ujiie

Mikako Ujiie has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and method of manufacturing the same
    Patent number: 6853089
    Abstract: In the manufacture of a semiconductor device by adopting a block molding method wherein a semiconductor chip is fixed onto a wiring substrate through an adhesive, the occurrence of a defect caused by flowing-out of the adhesive is to be prevented. The semiconductor device according to the present invention comprises a wiring substrate, the wiring substrate having a main surface, an insulating film formed on the main surface, and electrodes formed on the main surface so as to be exposed from the insulating film, a semiconductor chip fixed through an adhesive onto the insulating film formed on the main surface of the wiring substrate, conductive wires for connecting the electrodes on the main surface of the wiring substrate and electrodes on the semiconductor chip with each other, and a seal member, i.e.
    Type: Grant
    Filed: August 22, 2002
    Date of Patent: February 8, 2005
    Assignees: Renesas Technology Corp., Hitachi ULSI Systems Co., Ltd.
    Inventors: Mikako Ujiie, Michiaki Sugiyama, Kazunari Suzuki, Masachika Masuda, Tamaki Wada
  • Semiconductor device and method of manufacturing the same
    Publication number: 20040197959
    Abstract: A method of manufacturing a semiconductor device, comprises providing a wiring substrate having a main surface, an insulating film formed on the main surface, and electrodes formed on the main surface so as to be exposed from the insulating film. A semiconductor chip is adhesively fixed to the insulating film. Conductive wires connect the electrodes on the main surface of the wiring substrate and electrodes on the chip. A groove is formed between the chip and the electrodes on the substrate. A protruding portion of the adhesive stays within the groove and does not reach the electrodes on the substrate.
    Type: Application
    Filed: April 16, 2004
    Publication date: October 7, 2004
    Applicants: Renesas Technology Corp., Hitachi ULSI Systems Co., Ltd.
    Inventors: Mikako Ujiie, Michiaki Sugiyama, Kazunari Suzuki, Masachika Masuda, Tamaki Wada
  • Semiconductor device and method of manufacturing the same
    Publication number: 20030052419
    Abstract: In the manufacture of a semiconductor device by adopting a block molding method wherein a semiconductor chip is fixed onto a wiring substrate through an adhesive, the occurrence of a defect caused by flowing-out of the adhesive is to be prevented. The semiconductor device according to the present invention comprises a wiring substrate, the wiring substrate having a main surface, an insulating film formed on the main surface, and electrodes formed on the main surface so as to be exposed from the insulating film, a semiconductor chip fixed through an adhesive onto the insulating film formed on the main surface of the wiring substrate, conductive wires for connecting the electrodes on the main surface of the wiring substrate and electrodes on the semiconductor chip with each other, and a seal member, i.e.
    Type: Application
    Filed: August 22, 2002
    Publication date: March 20, 2003
    Applicant: Hitachi, Ltd.
    Inventors: Mikako Ujiie, Michiaki Sugiyama, Kazunari Suzuki, Masachika Masuda, Tamaki Wada