Patents by Inventor Mikako Yokawa

Mikako Yokawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ultrasonic sensor comprising a metal/ferroelectric/metal/insulator/semiconductor structure
    Patent number: 7692257
    Abstract: A semiconductor element, a semiconductor sensor, and a semiconductor memory element are provided, in which an MFMIS structure having a lower electrode and an integrated circuit can be integrated. An epitaxially grown ?-Al2O3 single crystal film (2) is disposed on a semiconductor single crystal substrate (1), and an epitaxial single crystal Pt thin film (3) is disposed on the ?-Al2O3 single crystal film (2).
    Type: Grant
    Filed: March 5, 2004
    Date of Patent: April 6, 2010
    Assignee: National University Corporation Toyohashi University of Technology
    Inventors: Makoto Ishida, Kazuaki Sawada, Daisuke Akai, Mikako Yokawa, Keisuke Hirabayashi
  • Semiconductor element, semiconductor sensor and semiconductor memory element
    Publication number: 20060278907
    Abstract: A semiconductor element, a semiconductor sensor, and a semiconductor memory element are provided, in which an MFMIS structure having a lower electrode and an integrated circuit can be integrated. An epitaxially grown ?-Al2O3 single crystal film (2) is disposed on a semiconductor single crystal substrate (1), and an epitaxial single crystal Pt thin film (3) is disposed on the ?-Al2O3 single crystal film (2).
    Type: Application
    Filed: March 5, 2004
    Publication date: December 14, 2006
    Applicant: JAPAN SCIENCE AND TECHNOLOGY AGENCY
    Inventors: Makoto Ishida, Kazuaki Sawada, Daisuke Akai, Mikako Yokawa, Keisuke Hirabayashi