Abstract: A decorative light guide element having a decorative surface made of segments, at least one of which is a decorative light guide element, and method for producing such a decorative light guide element with illumination and decorative functions. To provide a decorative light guide element, which facilitates illumination independent of the decoration but also has visible decoration when deactivated, provision is made for the decorative light guide element to have a planar light guide element and a light source for coupling light into the light guide element. On a first side of the light guide element, a planar decorative element and, on the opposite side, a microstructure layer for coupling out the light of the light guide element are arranged. An intermediate layer is arranged between the light guide and decorative elements. The intermediate layer having a lower refractive index than the material of the light guide element.

Abstract: A decorative light guide element having a decorative surface made of segments, at least one of which is a decorative light guide element, and method for producing such a decorative light guide element with illumination and decorative functions. To provide a decorative light guide element, which facilitates illumination independent of the decoration but also has visible decoration when deactivated, provision is made for the decorative light guide element to have a planar light guide element and a light source for coupling light into the light guide element. On a first side of the light guide element, a planar decorative element and, on the opposite side, a microstructure layer for coupling out the light of the light guide element are arranged. An intermediate layer is arranged between the light guide and decorative elements. The intermediate layer having a lower refractive index than the material of the light guide element.

Abstract: A process for producing at least one photonic component (32, 33, 35, 39, 41), includes inserting the photonic component (32, 33, 35, 39, 41) into a surface layer (12) of a semiconductor wafer and/or within a semiconductor wafer, especially of a semiconductor chip (11, 31, 34, 38, 40) for the simpler and more cost-effective production with the most desired possible three-dimensional structures. At least one laser beam (22) is coupled into the material of the surface layer (12) and/or of the semiconductor wafer, in which the laser beam (22) is focused at a predetermined depth in the material. At least one property of the material and/or the material structure is changed in the area of focus (23, 36).

Abstract: A process for producing at least one photonic component (32, 33, 35, 39, 41), includes inserting the photonic component (32, 33, 35, 39, 41) into a surface layer (12) of a semiconductor wafer and/or within a semiconductor wafer, especially of a semiconductor chip (11, 31, 34, 38, 40) for the simpler and more cost-effective production with the most desired possible three-dimensional structures. At least one laser beam (22) is coupled into the material of the surface layer (12) and/or of the semiconductor wafer, in which the laser beam (22) is focused at a predetermined depth in the material. At least one property of the material and/or the material structure is changed in the area of focus (23, 36).