Abstract: A substrate for a ball grid array (BGA) integrated circuit package. The top surface of the substrate has a center die paddle and a plurality of bonding fingers. The bonding fingers are arranged into four segments which each have a pattern that approximates a segment of a hyperbola. Located between the bonding fingers and the die paddle are a plurality of inner bond pads. The die paddle, bonding fingers and inner bond pads are all connected to external bond pads located on an opposite bottom surface of the substrate. The hyperbolic bonding finger pattern and additional inner bond pads increase the pin count and/or decrease the die size of the package.