Patents by Inventor Mike Bilos

Mike Bilos has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8821679
    Abstract: The present invention provides a bimetal laminate structure and improved method for manufacturing the same. The method includes: applying a layer of adhesive to a metallic substrate; and laminating a decorative metallic sheet to the metallic substrate in such a manner that substantially all surface defects and all read through appearance along an outer surface of the decorative metallic sheet are eliminated. The resultant bimetal laminate includes a decorative metallic layer consisting of a first metallic material, and a metallic substrate consisting of a second metallic material that is different from the first metallic material. The metal substrate has a thickness that is greater than the thickness of the decorative metallic layer. An adhesive layer is disposed between, and spans substantially the entirety of the decorative metallic layer and metallic substrate to rigidly attach the same.
    Type: Grant
    Filed: April 25, 2008
    Date of Patent: September 2, 2014
    Assignee: Material Sciences Corporation
    Inventors: Robert Roelofs, Dan Bullard, Mike Bilos, Bryan Tullis
  • Publication number: 20090269562
    Abstract: The present invention provides a bimetal laminate structure and improved method for manufacturing the same. The method includes: applying a layer of adhesive to a metallic substrate; and laminating a decorative metallic sheet to the metallic substrate in such a manner that substantially all surface defects and all read through appearance along an outer surface of the decorative metallic sheet are eliminated. The resultant bimetal laminate includes a decorative metallic layer consisting of a first metallic material, and a metallic substrate consisting of a second metallic material that is different from the first metallic material. The metal substrate has a thickness that is greater than the thickness of the decorative metallic layer. An adhesive layer is disposed between, and spans substantially the entirety of the decorative metallic layer and metallic substrate to rigidly attach the same.
    Type: Application
    Filed: April 25, 2008
    Publication date: October 29, 2009
    Applicant: MATERIAL SCIENCES CORPORATION
    Inventors: Robert Roelofs, Dan Bullard, Mike Bilos, Bryan Tullis