Patents by Inventor Mike Boyd

Mike Boyd has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHODS AND SYSTEMS FOR MANAGING AIRFLOW IN CONDUITS AND PNEUMATIC TUBES
    Publication number: 20210147163
    Abstract: Methods and system for managing airflow across pipe or tube connections are provided. In some embodiments, methods and systems are provided that are well suited for use in pneumatic tube delivery systems having connections between tubes of different diameter. Airflow sources and management devices are provided to accommodate pressure changes and energy changes associated with pipe or tube expansions and contractions.
    Type: Application
    Filed: November 18, 2020
    Publication date: May 20, 2021
    Inventors: George Archambault, Greg Arbour, Mike Boyd
  • Methods of fabricating robust integrated heat spreader designs and structures formed thereby
    Patent number: 8174113
    Abstract: Methods and associated structures of forming an indium containing solder material directly on an active region of a copper IHS is enabled. A copper indium containing solder intermetallic is formed on the active region of the IHS. The solder intermetallic improves the solder-TIM integration process for microelectronic packaging applications.
    Type: Grant
    Filed: September 17, 2008
    Date of Patent: May 8, 2012
    Assignee: Intel Corporation
    Inventors: Abhishek Gupta, Mike Boyd, Carl Deppisch, Jinlin Wang, Daewoong Suh, Brad Drew
  • Methods of fabricating robust integrated heat spreader designs and structures formed thereby
    Publication number: 20100065246
    Abstract: Methods and associated structures of forming an indium containing solder material directly on an active region of a copper HIS is enabled. A copper indium containing solder intermetallic is formed on the active region of the IHS. The solder intermetallic improves the solder-TIM integration process for microelectronic packaging applications.
    Type: Application
    Filed: September 17, 2008
    Publication date: March 18, 2010
    Inventors: Abhishek Gupta, Mike Boyd, Carl Deppisch, Jinlin Wang, Daewoong Suh, Brad Drew