Patents by Inventor Mike E. Potter

Mike E. Potter has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of reducing electrical discharge in a structure
    Patent number: 7887732
    Abstract: A current interrupter assembly includes an insulating structure, a current interrupter embedded in the structure, a conductor element embedded in the structure, a current interchange embedded in the structure and connected to create a current path between the current interrupter and the conductor element, and a semiconductive layer covering at least a portion of the conductor element so as to reduce voltage discharge between the conductor element and the structure.
    Type: Grant
    Filed: December 8, 2006
    Date of Patent: February 15, 2011
    Assignee: Cooper Technologies Company
    Inventors: Ross S. Daharsh, Mike E. Potter, Paul N. Stoving, E. Fred Bestel
  • Solid dielectric encapsulated interrupter with reduced corona levels and improved BIL
    Patent number: 7148441
    Abstract: A current interrupter assembly includes an insulating structure, a current interrupter embedded in the structure, a conductor element embedded in the structure, a current interchange embedded in the structure and connected to create a current path between the current interrupter and the conductor element, and a semiconductive layer covering at least a portion of the conductor element so as to reduce voltage discharge between the conductor element and the structure.
    Type: Grant
    Filed: April 19, 2005
    Date of Patent: December 12, 2006
    Assignee: McGraw-Edison Company
    Inventors: Ross S. Daharsh, Mike E. Potter, Paul N. Stoving, E. Fred Bestel
  • Solid dielectric encapsulated interrupter
    Patent number: 6888086
    Abstract: A current interrupter assembly includes an insulating structure, a current interrupter embedded in the structure, a conductor element embedded in the structure, a current interchange embedded in the structure and connected to create a current path between the current interrupter and the conductor element, and a semiconductive layer covering at least a portion of the conductor element so as to reduce voltage discharge between the conductor element and the structure.
    Type: Grant
    Filed: September 30, 2002
    Date of Patent: May 3, 2005
    Assignee: Cooper Technologies Company
    Inventors: Ross S. Daharsh, Mike E. Potter, Paul N. Stoving, E. Fred Bestel
  • Solid dielectric encapsulated interrupter
    Publication number: 20040061589
    Abstract: A current interrupter assembly includes an insulating structure, a current interrupter embedded in the structure, a conductor element embedded in the structure, a current interchange embedded in the structure and connected to create a current path between the current interrupter and the conductor element, and a semiconductive layer covering at least a portion of the conductor element so as to reduce voltage discharge between the conductor element and the structure.
    Type: Application
    Filed: September 30, 2002
    Publication date: April 1, 2004
    Inventors: Ross S. Daharsh, Mike E. Potter, Paul N. Stoving, E. Fred Bestel