Abstract: Systems and methods of fabricating circuit board assemblies may provide for a circuit board assembly that includes an expansion card having a first side and a second side, a first set of semiconductor packages coupled to the first side and a second set of semiconductor packages coupled to the second side. The circuit board assembly may also include a synergistic combination of cooling solutions for the expansion card such as a metallic duct, centrifugal fan or secondary plate, structural solutions for the expansion card such as a clamp structure or retention interlock, and volume reduction solutions for the expansion card such as one or more flipped power connectors.

Abstract: Systems and methods of fabricating circuit board assemblies may provide for a circuit board assembly that includes an expansion card having a first side and a second side, a first set of semiconductor packages coupled to the first side and a second set of semiconductor packages coupled to the second side. The circuit board assembly may also include a synergistic combination of cooling solutions for the expansion card such as a metallic duct, centrifugal fan or secondary plate, structural solutions for the expansion card such as a clamp structure or retention interlock, and volume reduction solutions for the expansion card such as one or more flipped power connectors.

Abstract: An apparatus for receiving and securing a processor on a mainboard in a computer system. The apparatus includes a socket and socket loading mechanism for a land grid array. The apparatus provides a load distribution mechanism to dissipate tensile and shearing forces at the corner of the socket to protect a solder ball grid array. This improves the durability of the solder ball grid array and increases the power of the processors that may be supported by the socket.

Abstract: A heat sink assembly is coupled to a motherboard and an electronic device on the motherboard. The heat sink assembly includes a heat sink with an opening extending through the heat sink, and a pin that extends through the motherboard and the opening in the heat sink to couple the heat sink to the electronic device and the motherboard. A member within the opening in the heat sink is positioned between the heat sink and the pin. A method of securing a heat sink to a motherboard and an electronic device on the motherboard includes thermally coupling a heat sink to an electronic device, securing the heat sink to a motherboard using a pin that extends through an opening in the heat sink, and positioning a member between the pin and the heat sink within the opening in the heat sink.

Abstract: In some embodiments, an apparatus includes a circuit board, a plurality of metal inserts, and a heat sink having a plurality of mounting holes. Each of the metal inserts may include at least one lower member soldered to the circuit board, and an upper portion received in a respective one of the mounting holes of the heat sink and secured to the respective one of the mounting holes by a respective fastener.

Abstract: A heat sink assembly is coupled to a motherboard and an electronic device on the motherboard. The heat sink assembly includes a heat sink with an opening extending through the heat sink, and a pin that extends through the motherboard and the opening in the heat sink to couple the heat sink to the electronic device and the motherboard. A member within the opening in the heat sink is positioned between the heat sink and the pin. A method of securing a heat sink to a motherboard and an electronic device on the motherboard includes thermally coupling a heat sink to an electronic device, securing the heat sink to a motherboard using a pin that extends through an opening in the heat sink, and positioning a member between the pin and the heat sink within the opening in the heat sink.

Abstract: A digital camera stand comprising a main body and a tilting body received within a cavity formed within a top portion of the main body and coupled to the main body along a pivot axis. The tilting body includes indexed portions, preferably a parallel arrangement of notches formed along the back portion of the tilting body, adapted to engage with an indexer coupled to the main body to allow indexed tilting of the tilting body relative to the main body as the indexer is engaged with a selected one of the notches. One end of a data connector is received through a shell of the tilting body and presents a data connection adapted to couple with a complementary connector on a base portion of the digital camera maintained within a pocket of the tilting body.

Abstract: A digital camera stand comprising a main body and a tilting body received within a cavity formed within a top portion of the main body and coupled to the main body along a pivot axis. The tilting body includes indexed portions, preferably a parallel arrangement of notches formed along the back portion of the tilting body, adapted to engage with an indexer coupled to the main body to allow indexed tilting of the tilting body relative to the main body as the indexer is engaged with a selected one of the notches. One end of a data connector is received through a shell of the tilting body and presents a data connection adapted to couple with a complementary connector on a base portion of the digital camera maintained within a pocket of the tilting body.