Patents by Inventor Mike Gasparek

Mike Gasparek has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Capillary underflow integral heat spreader
    Patent number: 7439617
    Abstract: A cooling device including a thermally conductive body with a first mating surface, a first solder wettable material disposed in a pattern at a portion of the first mating surface, and a reflowable solder material disposed at the first mating surface. A portion of the solder material is configured to be capable of contacting an adjacently disposed second mating surface, and when melted, to form a single flow front through a bond line gap between the first mating surface of the cooling device and the second mating surface of, for example, a thermal component. A mating surface of the cooling device is positioned adjacent to a mating surface of a thermal component and the solder material is heated at least to its melting point.
    Type: Grant
    Filed: June 30, 2006
    Date of Patent: October 21, 2008
    Assignee: Intel Corporation
    Inventors: Carl Deppisch, Tom Fitzgerald, Fay Hua, Wei Shi, Mike Gasparek
  • Capillary underflow integral heat spreader
    Publication number: 20080017975
    Abstract: A cooling device including a thermally conductive body with a first mating surface, a first solder wettable material disposed in a pattern at a portion of the first mating surface, and a reflowable solder material disposed at the first mating surface. A portion of the solder material is configured to be capable of contacting an adjacently disposed second mating surface, and when melted, to form a single flow front through a bond line gap between the first mating surface of the cooling device and the second mating surface of, for example, a thermal component. A mating surface of the cooling device is positioned adjacent to a mating surface of a thermal component and the solder material is heated at least to its melting point.
    Type: Application
    Filed: June 30, 2006
    Publication date: January 24, 2008
    Inventors: Carl Deppisch, Tom Fitzgerald, Fay Hua, Wei Shi, Mike Gasparek