Patents by Inventor Mike Goetsch

Mike Goetsch has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for filling vias in organic, multi-layer packages
    Patent number: 6098283
    Abstract: A via for an electronic assembly. The assembly includes a substrate which has a via hole. The via hole is filled with a conductive material that extends across a diameter of the hole. The via hole can be filled by reflowing a solder ball that is attached to an outer surface of the substrate. The substrate may be part of a multi-layered integrated circuit package, wherein the vias couples internal routing layers with external contacts of the package. The filled vias can withstand extended thermal life cycles of the package.
    Type: Grant
    Filed: May 13, 1998
    Date of Patent: August 8, 2000
    Assignee: Intel Corporation
    Inventors: Mike Goetsch, Jim Siettmann, Leo Craft, Eric Swanger