Patents by Inventor Mike Gruenhagen

Mike Gruenhagen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • RELIABLE WAFER-LEVEL CHIP-SCALE SOLDER BUMP STRUCTURE
    Publication number: 20100117231
    Abstract: A wafer level chip scale package (WLCSP) includes a semiconductor device with a plurality of solder bump pads, patterned passivation regions above each of the solder bump pads, a patterned under bump metallization (UBM) region on each of the solder bump pads and the passivation regions, a polyimide region over a portion of the UBM regions and the passivation regions, solder bumps formed on each of the UBM regions.
    Type: Application
    Filed: January 20, 2010
    Publication date: May 13, 2010
    Inventors: Dennis Lang, Sonbol Vaziri, James Kent Naylor, Eric Woolsey, Chung-Lin Wu, Mike Gruenhagen, Neill Thornton
  • RELIABLE WAFER-LEVEL CHIP-SCALE PACKAGE SOLDER BUMP STRUCTURE IN A PACKAGED SEMICONDUCTOR DEVICE
    Publication number: 20080054461
    Abstract: A wafer level chip scale package (WLCSP) includes a packaged semiconductor device with a plurality of solder bump pads, patterned passivation regions above each of the solder bump pads, a patterned under bump metallization (UBM) region on each of the solder bump pads and the passivation regions, a polyimide region over a portion of the UBM regions and the passivation regions, solder bumps formed on each of the UBM regions, and encapsulation material surrounding the semiconductor die except for at least a portion of each of the solder bumps.
    Type: Application
    Filed: August 30, 2007
    Publication date: March 6, 2008
    Inventors: Dennis Lang, Sonbol Vaziri, James Naylor, Eric Woolsey, Chung-Lin Wu, Mike Gruenhagen, Neill Thornton