Patents by Inventor Mike Irvin

Mike Irvin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Power supply module utilizing expansion power supply units to increase power supply capacity
    Patent number: 6424547
    Abstract: A power supply module includes a plurality of power supply modules. One of the power supply units is designated as a master power supply unit. Other power supply units are handled as expansion power supply units. The power supply modules can be connected in parallel on a DIN rail so that the master power supply unit may supply an external AC voltage to the expansion power supply units. When a desired power supply capacity exceeds a power supply capacity of the master power supply unit, an expansion power supply unit is connected in parallel with the master power supply unit in order to increase the power supply capacity.
    Type: Grant
    Filed: May 29, 2001
    Date of Patent: July 23, 2002
    Assignee: Omron Corporation
    Inventors: Haruyasu Murabayashi, Takashi Horie, Masashi Isozumi, Yasuhiro Tsubota, Tsunetoshi Ooba, Hideki Kobori, Takatoshi Ootomo, Katsuya Marumo, Theo Brusse, Mike Irvin
  • Power supply module and power supply unit using the same
    Publication number: 20010046144
    Abstract: A power supply module includes a plurality of power supply modules. One of the power supply units is designated as a master power supply unit. Other power supply units are handled as expansion power supply units. The power supply modules can be connected in parallel on a DIN rail so that the master power supply unit may supply an external AC voltage to the expansion power supply units. When a desired power supply capacity exceeds a power supply capacity of the master power supply unit, an expansion power supply unit is connected in parallel with the master power supply unit in order to increase the power supply capacity.
    Type: Application
    Filed: May 29, 2001
    Publication date: November 29, 2001
    Applicant: Omron Corporation
    Inventors: Haruyasu Murabayashi, Takashi Horie, Masashi Isozumi, Yasuhiro Tsubota, Tsunetoshi Ooba, Hideki Kobori, Takatoshi Ootomo, Katsuya Marumo, Theo Brusse, Mike Irvin