Abstract: A contacting device having a carrier and at least one contacting unit, wherein the carrier has a bottom side and a top side, the top side of the carrier having a plurality of mutually insulated conductive tracks, the contacting unit having a plurality of contact elements that at least partially are formed of an electrically conductive material and in each case are mutually electrically insulated, each contact element along a longitudinal axis being composed of at least one fixing section and a contacting portion adjoining the fixing section, each fixing section being supported on the top side of the carrier, having a first contact surface and being positively and conductively connected to one of the conductive tracks, each contacting portion having a distance to the top side varying between zero and a maximum distance.

Abstract: A contacting device having a carrier and at least one contacting unit, wherein the carrier has a bottom side and a top side, the top side of the carrier having a plurality of mutually insulated conductive tracks, the contacting unit having a plurality of contact elements that at least partially are formed of an electrically conductive material and in each case are mutually electrically insulated, each contact element along a longitudinal axis being composed of at least one fixing section and a contacting portion adjoining the fixing section, each fixing section being supported on the top side of the carrier, having a first contact surface and being positively and conductively connected to one of the conductive tracks, each contacting portion having a distance to the top side varying between zero and a maximum distance.

Abstract: A contact device system having a plate-shaped carrier and at least five accommodating areas are disposed on a bottom side of the pressing unit, at least five accommodating areas and at least five contact area pairs are disposed on a top side of the carrier. The contact area pairs each have a first and second electrically conductive contact area, and in each case the first contact area is spaced apart from the second contact area and insulated electrically therefrom. The first and second contact areas have a functional electrical connection to an evaluation circuit via a trace section. The carrier has a plurality of accommodating areas for a packaged electronic component, that each have one of the at least five contact area pairs. The electronic components have at least two terminal contacts, whereby after accommodation of the packaged electronic components, the terminal contacts of the particular component are pressed down.

Abstract: A contact device system having a plate-shaped carrier and at least five accommodating areas are disposed on a bottom side of the pressing unit, at least five accommodating areas and at least five contact area pairs are disposed on a top side of the carrier. The contact area pairs each have a first and second electrically conductive contact area, and in each case the first contact area is spaced apart from the second contact area and insulated electrically therefrom. The first and second contact areas have a functional electrical connection to an evaluation circuit via a trace section. The carrier has a plurality of accommodating areas for a packaged electronic component, that each have one of the at least five contact area pairs. The electronic components have at least two terminal contacts, whereby after accommodation of the packaged electronic components, the terminal contacts of the particular component are pressed down.

Abstract: An electrical circuit includes at least two unit cells configured on a planar substrate which extends in one plane. The unit cells respectively have at least two contact points with a different function and include at least one dielectric layer disposed on the substrate and/or on the unit cells and at least two contact surfaces which are disposed parallel to the plane above the contact points and/or the substrate. The contact points with the same function are connected electrically to at least one common contact surface for at least a part of the contact points of the same function via at least one through-contacting through the dielectric layer and able to be contacted in common from outside via the corresponding contact surfaces.

Abstract: An electronic component includes a printed conductor structure on a substrate, as well as a film which contacts the printed conductor structure. The film has a smaller layer thickness than the printed conductor. The printed conductor structure has a region which is covered by the film for the purpose of contacting.

Abstract: A semiconductor sensor determines physical and/or chemical properties of a medium, in particular a pH sensor. The semiconductor sensor has an electronic component with a sensitive surface, said component being constructed for its part on the basis of semiconductors with a large band gap (wide-gap semiconductor). The sensitive surface is provided at least in regions with a functional layer sequence which has an ion-sensitive surface. The functional layer sequence has at least one layer which is impermeable at least for the medium and/or the materials or ions to be determined.

Abstract: An electronic component has at least one contact surface situated in a contact plane, at least one insulating layer disposed above the contact plane, at least one stabilizing layer disposed on the insulating layer for increasing a mechanical stability of the component, and at least one of a bonding contact and a soldering contact. The insulating layer and the stabilizing layer have at least one opening which opens in an upper side of the stabilizing layer. The upper side of the stabilizing layer is oriented away from the contact surface. The opening extends through the stabilizing layer and the insulating layer as far as the contact surface. The at least one of a bonding contact and a soldering contact extends over the stabilizing layer and touches the contact surface through the opening.

Abstract: An electronic component includes a printed conductor structure on a substrate, as well as a film which contacts the printed conductor structure. The film has a smaller layer thickness than the printed conductor. The printed conductor structure has a region which is covered by the film for the purpose of contacting.

Abstract: A semiconductor actuator includes a substrate base, a bending structure which is connected to the substrate base and can be deflected at least partially relative to the substrate base. The bending structure has semiconductor compounds on the basis of nitrides of main group III elements and at least two electrical supply contacts which impress an electrical current in or for applying an electrical voltage to the bending structure. At least two of the supply contacts are disposed at a spacing from each other respectively on the bending structure and/or integrated in the latter.

Abstract: An electrical circuit includes at least two unit cells configured on a planar substrate which extends in one plane. The unit cells respectively have at least two contact points with a different function and include at least one dielectric layer disposed on the substrate and/or on the unit cells and at least two contact surfaces which are disposed parallel to the plane above the contact points and/or the substrate. The contact points with the same function are connected electrically to at least one common contact surface for at least a part of the contact points of the same function via at least one through-contacting through the dielectric layer and able to be contacted in common from outside via the corresponding contact surfaces.

Abstract: A semiconductor component includes a substrate, at least one oblong first electrode disposed on the substrate and at least one second electrode disposed on the substrate. The first and/or the second electrode respectively are closed in its longitudinal direction.

Abstract: A semiconductor sensor determines physical and/or chemical properties of a medium, in particular a pH sensor. The semiconductor sensor has an electronic component with a sensitive surface, said component being constructed for its part on the basis of semiconductors with a large band gap (wide-gap semiconductor). The sensitive surface is provided at least in regions with a functional layer sequence which has an ion-sensitive surface. The functional layer sequence has at least one layer which is impermeable at least for the medium and/or the materials or ions to be determined.

Abstract: A semiconductor actuator includes a substrate base, a bending structure which is connected to the substrate base and can be deflected at least partially relative to the substrate base. The bending structure has semiconductor compounds on the basis of nitrides of main group III elements and at least two electrical supply contacts which impress an electrical current in or for applying an electrical voltage to the bending structure. At least two of the supply contacts are disposed at a spacing from each other respectively on the bending structure and/or integrated in the latter.

Abstract: The present invention relates to a sensor element which has a semiconductor structure based on a Group III-nitride. The semiconductor sensor element serves for determining the pressure, the temperature, a force, a deflection or an acceleration. It has a substrate base 1, disposed thereon, a homogeneous semiconductor layer based on a Group III-nitride, the surface of the homogeneous semiconductor layer 2 orientated towards the substrate base 1 having at least partially a spacing from the surface of the substrate base orientated towards the homogeneous semiconductor layer 2, 2f, and being distinguished in that at least two electrical conducting contacts 5 for conducting an electrical output signal, which can be generated by the homogeneous semiconductor layer 2, 2f, are disposed on, at or under the homogeneous semiconductor layer 2, 2f or are integrated in the latter.

Abstract: The present invention relates to a sensor element which has a semiconductor structure based on a Group III-nitride. The semiconductor sensor element serves for determining the pressure, the temperature, a force, a deflection or an acceleration. It has a substrate base 1, disposed thereon, a homogeneous semiconductor layer based on a Group III-nitride, the surface of the homogeneous semiconductor layer 2 orientated towards the substrate base 1 having at least partially a spacing from the surface of the substrate base orientated towards the homogeneous semiconductor layer 2, 2f, and being distinguished in that at least two electrical conducting contacts 5 for conducting an electrical output signal, which can be generated by the homogeneous semiconductor layer 2, 2f, are disposed on, at or under the homogeneous semiconductor layer 2, 2f or are integrated in the latter.