Patents by Inventor Mike Len

Mike Len has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing printed circuit board assemblies with engineered thermal paths
    Patent number: 11711885
    Abstract: A printed circuit board (PCB) having an engineered thermal path and a method of manufacturing are disclosed herein. In one aspect, the PCB includes complementary cavities formed on opposite sides of the PCB. The complementary cavities are in a thermal communication and/or an electrical communication to form the engineered thermal path and each cavity is filled with a thermally conductive material to provide a thermal pathway for circuits and components of the PCB. The method of manufacturing may further include drilling and/or milling each cavity, panel plating the cavities and filling the cavities with a suitable filling material.
    Type: Grant
    Filed: January 29, 2021
    Date of Patent: July 25, 2023
    Assignee: TTM Technologies, Inc.
    Inventors: Rick Bauer, Jerrad Martinson, Shane Hoffstatter, Doyle Laudal, Mike Lugert, Mike Len
  • PRINTED CIRCUIT BOARD ASSEMBLIES WITH ENGINEERED THERMAL PATHS AND METHODS OF MANUFACTURE
    Publication number: 20210243880
    Abstract: A printed circuit board (PCB) having an engineered thermal path and a method of manufacturing are disclosed herein. In one aspect, the PCB includes complementary cavities formed on opposite sides of the PCB. The complementary cavities are in a thermal communication and/or an electrical communication to form the engineered thermal path and each cavity is filled with a thermally conductive material to provide a thermal pathway for circuits and components of the PCB. The method of manufacturing may further include drilling and/or milling each cavity, panel plating the cavities and filling the cavities with a suitable filling material.
    Type: Application
    Filed: January 29, 2021
    Publication date: August 5, 2021
    Inventors: Rick Bauer, Jerrad Martinson, Shane Hoffstatter, Doyle Laudal, Mike Lugert, Mike Len