Patents by Inventor MIKE LESTER

MIKE LESTER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • HEAT-SHRINKABLE SLEEVE FOR USE ON TOOLING DURING THE PROCESS OF MANUFACTURING COMPOSITE PARTS
    Publication number: 20120263897
    Abstract: A heat-shrinkable sleeve (3) made of a self-releasing material and having a linear seam is disclosed along with methods of employing a heat-shrinkable sleeve (3) in a process of manufacturing composite parts, either as a release layer between the composite part (9) and tool (7), or on a composite material to provide a consolidation force to the composite part (9).
    Type: Application
    Filed: June 13, 2012
    Publication date: October 18, 2012
    Applicant: DUNSTONE COMPANY, INC.
    Inventors: Joseph A. Williams, IV, Mike Lester, Michael WILLIAMS
  • HEAT-SHRINKABLE SLEEVE FOR USE ON TOOLING DURING THE PROCESS OF MANUFACTURING COMPOSITE PARTS
    Publication number: 20100098889
    Abstract: A heat-shrinkable sleeve (3) made of a self-releasing material and having a linear seam is disclosed along with methods of employing a heat-shrinkable sleeve (3) in a process of manufacturing composite parts, either as a release layer between the composite part (9) and tool (7), or on a composite material to provide a consolidation force to the composite part (9).
    Type: Application
    Filed: October 20, 2009
    Publication date: April 22, 2010
    Applicant: DUNSTONE COMPANY, INC.
    Inventors: Joseph A. WILLIAMS, IV, Mike LESTER, Michael WILLIAMS
  • MICA TAPE SPLICE AND METHOD OF FORMING THE SAME
    Publication number: 20010003615
    Abstract: A splice and a method of making the same. The splice is formed to join together first and second pieces of mica tape having a mica layer bonded to a first surface of a carrier layer. The mica layer from a portion of the first piece is removed so as to expose the first surface of the carrier layer. A thermoplastic film is disposed on the exposed first surface of the carrier layer of the first piece. A second surface of the carrier layer of the second piece is disposed on the bonding film so as to form an overlap area of the first and second pieces. Pressure and heat are applied to the overlap area to form the splice therein.
    Type: Application
    Filed: February 19, 1998
    Publication date: June 14, 2001
    Inventor: MIKE LESTER