Patents by Inventor Mike Murtagh

Mike Murtagh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ROTARY ELECTRICAL FEEDTHROUGH INTEGRATION FOR PROCESS CHAMBER
    Publication number: 20240018646
    Abstract: Embodiments disclosed herein include semiconductor processing tools. In an embodiment, the semiconductor processing tool comprises a chamber, a chuck within the chamber, where the chuck is configured to rotate, a pedestal holder around the chuck, and a utility column coupled to the chuck. In an embodiment, the utility column comprises a magnetic coupler to enable rotation of portions of the utility column and the chuck, and a rotary electrical feedthrough.
    Type: Application
    Filed: July 14, 2022
    Publication date: January 18, 2024
    Inventors: ANANTHA SUBRAMANI, YANG GUO, JOHN FORSTER, WADE HARRELSON, ANDREW TOMKO, ANTHONY CHAN, SATHYA SWAROOP GANTA, MIKE MURTAGH, SANJEEV BALUJA
  • Apparatus and methods for real-time wafer chucking detection
    Patent number: 11791190
    Abstract: Substrate supports, substrate support assemblies and methods of using the substrate supports are described. The substrate support has a support surface with at least two electrodes and a plurality of purge channels bounded by a seal band. A power supply connected to the electrodes configured as an electrostatic chuck. A capacitance of the substrate is measured while on the substrate support to determine the chucking state of the substrate.
    Type: Grant
    Filed: May 7, 2021
    Date of Patent: October 17, 2023
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Tejas Ulavi, Arkaprava Dan, Mike Murtagh, Sanjeev Baluja
  • Apparatus and Methods for Real-Time Wafer Chucking Detection
    Publication number: 20210351060
    Abstract: Substrate supports, substrate support assemblies and methods of using the substrate supports are described. The substrate support has a support surface with at least two electrodes and a plurality of purge channels bounded by a seal band. A power supply connected to the electrodes configured as an electrostatic chuck. A capacitance of the substrate is measured while on the substrate support to determine the chucking state of the substrate.
    Type: Application
    Filed: May 7, 2021
    Publication date: November 11, 2021
    Applicant: Applied Materials, Inc.
    Inventors: Tejas Ulavi, Arkaprava Dan, Mike Murtagh, Sanjeev Baluja
  • Geometrically selective deposition of dielectric films utilizing low frequency bias
    Patent number: 11081318
    Abstract: Apparatus and methods for depositing and treating or etching a film are described. A batch processing chamber includes a plurality of processing regions with at least one plasma processing region. A low frequency bias generator is connected to a susceptor assembly to intermittently apply a low frequency bias to perform a directional treatment or etching the deposited film.
    Type: Grant
    Filed: December 14, 2018
    Date of Patent: August 3, 2021
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Kenichi Ohno, Keiichi Tanaka, Li-Qun Xia, Tsutomu Tanaka, Dmitry A. Dzilno, Mario D. Silvetti, John C. Forster, Rakesh Ramadas, Mike Murtagh, Alexander V. Garachtchenko
  • Geometrically Selective Deposition Of Dielectric Films Utilizing Low Frequency Bias
    Publication number: 20190189400
    Abstract: Apparatus and methods for depositing and treating or etching a film are described. A batch processing chamber includes a plurality of processing regions with at least one plasma processing region. A low frequency bias generator is connected to a susceptor assembly to intermittently apply a low frequency bias to perform a directional treatment or etching the deposited film.
    Type: Application
    Filed: December 14, 2018
    Publication date: June 20, 2019
    Inventors: Kenichi Ohno, Keiichi Tanaka, Li-Qun Xia, Tsutomu Tanaka, Dmitry A. Dzilno, Mario D. Silvetti, John C. Forster, Rakesh Ramadas, Mike Murtagh, Alexander V. Garachtchenko