Abstract: The present invention relates to an improved controlled (preferably delayed) release formulation for delivery of prednisolone sodium metasulphobenzoate. The formulation comprises prednisolone sodium metasulphobenzoate surrounded by a coating comprising glassy amylose, ethyl cellulose and dibutyl sebacate, wherein the ratio of amylose to ethyl cellulose is from (13.5) to (1:4.5) and wherein the amylose is corn or maize amylose.

Abstract: A method for making an anisotropic dielectric layer includes the steps of: forming a fluid layer comprising a plurality of magnetizable particles, for example, in a fluid capable of solidifying to fix the configuration of the magnetizable particles in a dielectric matrix; aligning the magnetizable particles of the fluid layer in a predetermined configuration by applying a magnetic field thereto; and fixing the aligned magnetizable particles in the predetermined configuration within the dielectric matrix by solidifying the fluid. In one particularly advantageous application, the fluid layer is coated onto a surface portion of an integrated circuit, such as a fingerprint sensor, to provide mechanical protection without effecting the image resolution.

Abstract: A fingerprint sensor includes an integrated circuit die and a protective covering of a z-axis anisotropic dielectric material. The die includes a conductive layer defining an array of electric field sensing electrodes. The z-axis anisotropic dielectric layer focusses an electric field at each of the electric field sensing electrodes. In other words, the dielectric covering may be relatively thick, but not result in defocussing of the electric fields propagating through the dielectric covering because of the z-axis anisotropy of the material. The z-axis anisotropic dielectric layer may be provided by a plurality of oriented dielectric particles in a cured matrix. For example, the z-axis anisotropic dielectric layer may comprise barium titanate in a polyimide matrix. The conductive layer preferably comprises a plurality of capacitive coupling pads for permitting capacitive coupling with the integrated circuit die.

Abstract: A fingerprint and token sensor system includes an array of fingerprint sensing elements for generating signals related to a fingerprint based upon a finger being positioned adjacent the sensing elements, and a token for also causing the sensing elements to generate signals related to a token message based upon the token being positioned adjacent the sensing elements. Accordingly, the single sensor may be used for both fingerprints and for reading data from a token for range of useful purposes. Each fingerprint sensing element may preferably include an electric field sensing electrode, and a shield associated with a respective electric field sensing electrode. A drive circuit may be connected to the array of electric field sensing electrodes for driving same. The sensor is preferably in the form of an integrated circuit and includes a substrate adjacent the array of fingerprint sensing elements.

Abstract: A fingerprint and token sensor system includes an array of fingerprint sensing elements for generating signals related to a fingerprint based upon a finger being positioned adjacent the sensing elements, and a token for also causing the sensing elements to generate signals related to a token message based upon the token being positioned adjacent the sensing elements. Accordingly, the single sensor may be used for both fingerprints and for reading data from a token for range of useful purposes. Each fingerprint sensing element may preferably include an electric field sensing electrode, and a shield associated with a respective electric field sensing electrode. A drive circuit may be connected to the array of electric field sensing electrodes for driving same. The sensor is preferably in the form of an integrated circuit and includes a substrate adjacent the array of fingerprint sensing elements.

Abstract: A method is for making a chip package of a type including a carrier and a chip connected thereto using optical alignment techniques. One method includes the steps of: providing a transparent film having chip alignment and carrier alignment indicia thereon, optically detecting the chip through the transparent film and aligning the transparent film and the chip based upon the chip alignment indicia. Similarly, the method may include optically detecting the carrier through the transparent film and aligning the transparent film and the carrier based upon the carrier alignment indicia. In addition, the method further includes securing the chip, transparent film and carrier together, such as by providing a thermoplastic transparent film which may heated for adhesively securing the components. The transparent film may be a transparent z-axis conductive film, or a dielectric transparent film.