Abstract: An apparatus including a composite structure including an expanded graphite matrix infiltrated with a phase change material having dimensions configured for association with an electronic device, the composite structure including a thermal conductivity greater than 5 Watts per meter Kelvin (W/mK). An apparatus including an integrated circuit package; a planar pad including an expanded graphite matrix; and a heat sink, wherein the pad is disposed between the integrated circuit package and the heat sink. A method including placing a structure including an expanded graphite matrix on an integrated circuit package; and coupling a passive heat exchanger to the structure.