Patents by Inventor Mike Strittmatter

Mike Strittmatter has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermal protection of electrical elements systems
    Patent number: 6021046
    Abstract: A thermal protection system that comprises an assembly of at least one electrical component and a heat shield surrounding the electrical component, wherein the heat shield forms a pocket between the electrical element and the heat shield and associated methods. The electrical element has at least one electrical lead. The system permits the electrical lead(s) to increase in temperature sufficient to permit soldering of the electrical lead(s) to a second electrical element. The thermal protection system also comprises a heat sink to protect the electrical element, which comprises a heat capacity material. The system also comprises electrical lead(s) with a low-cross sectional area.
    Type: Grant
    Filed: December 15, 1995
    Date of Patent: February 1, 2000
    Assignee: Dallas Semiconductor Corporation
    Inventors: Neil McLellan, Mike Strittmatter
  • Method of providing thermal protection of electrical elements
    Patent number: 5913552
    Abstract: A thermal protection system that assembly of at least one electrical components and a heat shield surrounding the electrical component, wherein the heat shield forms a pocket between the electrical element and the heat shield and associated methods. The electrical element has at least one electrical lead. The system permits the electrical lead(s) to increase in temperature sufficient to permit soldering of the electrical lead(s) to a second electrical element. The thermal protection system also comprises a heat sink to protect the electrical element, which comprises a heat capacity material. The system also comprises electrical lead(s) with a low-cross sectional area.
    Type: Grant
    Filed: August 19, 1997
    Date of Patent: June 22, 1999
    Assignee: Dallas Semiconductor Corporation
    Inventors: Neil McLellan, Mike Strittmatter
  • Method of assembling electronic component
    Patent number: 5647121
    Abstract: A socket system that comprises a printed circuit board; an electrical module; and a socket having a hollow core. The socket holds the electrical module and is capable of electrically coupling the electrical module to the printed circuit board. The electrical module has at least one electrical lead. The socket has at least one electrical lead capable of electrically coupling with the electrical lead(s) of the electrical module. The electrical module comprises a second printed circuit board having a first and second surface; a lithium battery positioned on the first surface of the second printed circuit board and electrically coupled with the second printed circuit board, a crystal positioned on the first surface of said second printed circuit board and electrically coupled with the second printed circuit board, and an integrated circuit positioned on the second surface of the second printed circuit board.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: July 15, 1997
    Assignee: Dallas Semiconductor Corporation
    Inventors: Neil McLellan, Mike Strittmatter, Joseph Patrick Hundt, Christopher M. Sells, Francis A. Scherpenberg
  • Enhanced low profile sockets and module systems
    Patent number: 5579206
    Abstract: A socket system that comprises a printed circuit board; an electrical module; and a socket having a hollow core. The socket holds the electrical module and is capable of electrically coupling the electrical module to the printed circuit board. The electrical module has at least one electrical lead. The socket has at least one electrical lead capable of electrically coupling with the electrical lead(s) of the electrical module. The electrical module comprises a second printed circuit board having a first and second surface; a lithium battery positioned on the first surface of the second printed circuit board and electrically coupled with the second printed circuit board, a crystal positioned on the first surface of the second printed circuit board and electrically coupled with the second printed circuit board, and an integrated circuit positioned on the second surface of the second printed circuit board. A cap extends around and encloses and seals electrical elements of the electrical module.
    Type: Grant
    Filed: September 12, 1994
    Date of Patent: November 26, 1996
    Assignee: Dallas Semiconductor Corporation
    Inventors: Neil McLellan, Mike Strittmatter, Joseph P. Hundt, Christopher M. Sells, Francis A. Scherpenberg
  • Low profile sockets and modules for surface mountable applications
    Patent number: 5528463
    Abstract: A socket system that comprises a printed circuit board; an electrical module; and a socket having a hollow core. The socket holds the electrical module and is capable of electrically coupling the electrical module to the printed circuit board. The electrical module has at least one electrical lead. The socket has at least one electrical lead capable of electrically coupling with the electrical lead(s) of the electrical module. The electrical module comprises a second printed circuit board having a first and second surface; a lithium battery positioned on the first surface of the second printed circuit board and electrically coupled with the second printed circuit board, a crystal positioned on the first surface of said second printed circuit board and electrically coupled with the second printed circuit board, and an integrated circuit positioned on the second surface of the second printed circuit board.
    Type: Grant
    Filed: July 16, 1993
    Date of Patent: June 18, 1996
    Assignee: Dallas Semiconductor Corp.
    Inventors: Neil McLellan, Mike Strittmatter, Joseph P. Hundt, Christopher M. Sells, Francis A. Scherpenberg