Abstract: Provided is a semiconductor flip chip die metal layout which provides a flat UBM where surface metal pads are narrower than UBMs in order to accommodate decreased die pitch. This is achieved by depositing a metal region adjacent to and closely spaced from the pad which, together with the pad, is capable of providing a substrate that will result in a substantially flat passivation layer surface on which the UBM is subsequently deposited. The adjacent closely spaced metal region may be provided by bringing metal traces closer to a reduced size surface metal pad (into the die surface area underlying the UBM), and/or by depositing dummy metal similarly near the pad. The dummy metal may also be deposited over the whole chip surface area not occupied by other electrical components.

Abstract: A semiconductor memory layout definition for connection to a power supply bus in an integrated circuit layout pattern. The layout definition includes an outline and a plurality of power supply conductor segments within the outline. At least one of the power supply conductor segments has a direct strap identifier which indicates a desired attachment to the power supply bus. The direct strap identifier is passed to a routing design tool which routes a direct strap conductor from the power supply bus to the power supply conductor segments having the direct strap identifier.