Patents by Inventor Mike T. Reiter

Mike T. Reiter has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7304381
    Abstract: In some embodiments, an integrated circuit package includes a substrate and a heat spreader coupled to the substrate by fasteners. Thermal interface material thermally couples the die to the heat spreader. The heat spreader is provided over the die and is attached to the substrate with fasteners rather than a sealant-adhesive. Some examples of suitable fasteners may include rivets, barbed connectors, and gripping clips.
    Type: Grant
    Filed: August 2, 2006
    Date of Patent: December 4, 2007
    Assignee: Intel Corporation
    Inventors: Christopher L. Rumer, Sabina J. Houle, Oswald L. Skeete, Mike T. Reiter, Jeff R. Wienrich
  • Publication number: 20040238947
    Abstract: In some embodiments, an integrated circuit package includes a substrate and a heat spreader coupled to the substrate by fasteners. Thermal interface material thermally couples the die to the heat spreader. The heat spreader is provided over the die and is attached to the substrate with fasteners rather than a sealant-adhesive. Some examples of suitable fasteners may include rivets, barbed connectors, and gripping clips.
    Type: Application
    Filed: May 28, 2003
    Publication date: December 2, 2004
    Applicant: Intel Corporation
    Inventors: Christopher L. Rumer, Sabina J. Houle, Oswald L. Skeete, Mike T. Reiter, Jeff R. Wienrich