Abstract: A chamber with a fluid distribution network for uniform fluid flow within the chamber is provided. The chamber includes a first chamber wall that has a first surface and an opposing interior surface. The first surface is formed with a first set of channels, and the interior surface is exposed to the interior of the chamber and includes a plurality of interior ports that are connected to a plurality of the first set of channels. The chamber also includes a second chamber wall that has a second surface and an opposing exterior surface. The second surface has a second set of channels that partially intersect the first set of channels when the first surface is mated with the second surface. The exterior surface also includes at least one exterior port that provides access to the second set of channels.

Abstract: A method for drying a work piece is provided. The method includes raising a plurality of submerged workpieces supported on a first transition arm partially above a fluid/air interface and capturing the plurality of partially submerged workpieces during the raising by a second transition arm located above the fluid/air interface. A system for drying a workpiece is also included.

Abstract: A chamber with a fluid distribution network for uniform fluid flow within the chamber is provided. The chamber includes a first chamber wall that has a first surface and an opposing interior surface. The first surface is formed with a first set of channels, and the interior surface is exposed to the interior of the chamber and includes a plurality of interior ports that are connected to a plurality of the first set of channels. The chamber also includes a second chamber wall that has a second surface and an opposing exterior surface. The second surface has a second set of channels that partially intersect the first set of channels when the first surface is mated with the second surface. The exterior surface also includes at least one exterior port that provides access to the second set of channels.

Abstract: A system for drying a work piece is provided. The system includes a chamber containing a cleaning fluid in a first portion of the chamber and a drying region. The system includes a wet transition arm configured to support a plurality of work pieces while disposed in the cleaning fluid. A dry transition arn configured to accept the plurality of work pieces from the wet transition arm as the wet transition arm is being raised is also included. The dry transition arm and the wet transition arm are coupled to a common drive mechanism, wherein the common drive mechanism includes a first and a second motor. The first motor is configured to drive both the wet and dry transition arms. The second motor is configured to control an amount of separation between the wet and dry transition arms. A transition arm and method for drying a work piece are provided.

Abstract: A system and methods for substrate preparation are provided. In one example, a wafer processing system includes a system enclosure that contains wafer processing apparatus within an isolated wafer processing environment. The wafer processing apparatus include a pair of immersion tanks in the lower front region of the system with a pair of wafer pickers behind the immersion tanks to extract wafers from the tanks. In the rear of the system, a pair of brush boxes are located in a lower region with a pair of dryer units positioned above the brush boxes. A robot arm is positioned between the pair of immersion tanks and the pair of brush boxes in a middle region of the system, and is configured to transition wafers between the processing apparatus. A pair of output shelves holding output cassettes is positioned over the immersion tanks. The output cassettes receive clean wafers after processing.

Abstract: A system and methods for substrate preparation are provided. In one example, a wafer processing system includes a system enclosure that contains wafer processing apparatus within an isolated wafer processing environment. The wafer processing apparatus include a pair of immersion tanks in the lower front region of the system with a pair of wafer pickers behind the immersion tanks to extract wafers from the tanks. In the rear of the system, a pair of brush boxes are located in a lower region with a pair of dryer units positioned above the brush boxes. A robot arm is positioned between the pair of immersion tanks and the pair of brush boxes in a middle region of the system, and is configured to transition wafers between the processing apparatus. A pair of output shelves holding output cassettes is positioned over the immersion tanks. The output cassettes receive clean wafers after processing. In another example, a method for preparing a substrate is provided.

Abstract: A method of applying a fluid to a brush is provided. The method includes outputting a flow of fluid from a shaft to an area between the shaft and a distributor where the flow of fluid is restricted by the distributor to generate a uniform pressure buildup inside of the distributor. The method further includes delivering the fluid from the area through at least one opening in the distributor to an outer surface of the distributor where the outer surface of the distributor abuts an inner surface of a housing. The method additionally includes dispensing the fluid from between the outer surface of the distributor and the inner surface of the housing to an outer surface of the housing through at least one perforation in the housing, the housing being attached to a brush. The method also includes applying the fluid through the brush where the fluid is received from the outer surface of the housing.

Abstract: A system and methods for substrate preparation are provided. In one example, a wafer processing system includes a system enclosure that contains wafer processing apparatus within an isolated wafer processing environment. The wafer processing apparatus include a pair of immersion tanks in the lower front region of the system with a pair of wafer pickers behind the immersion tanks to extract wafers from the tanks. In the rear of the system, a pair of brush boxes are located in a lower region with a pair of dryer units positioned above the brush boxes. A robot arm is positioned between the pair of immersion tanks and the pair of brush boxes in a middle region of the system, and is configured to transition wafers between the processing apparatus. A pair of output shelves holding output cassettes is positioned over the immersion tanks. The output cassettes receive clean wafers after processing. In another example, a method for preparing a substrate is provided.

Abstract: A brush assembly includes a distributor having a slot matrix formed in an outer surface of the distributor, the slot matrix including a plurality of longitudinal slots intersecting a plurality of annular slots. The brush assembly further includes a housing having an inner surface abutting the outer surface of the distributor, a brush mounted on the housing and a shaft. During use, the flow of liquid from the shaft to the housing flows through the longitudinal slots and annular slots of the distributor. By appropriately selecting the dimensions and numbers of these slots, the flow of liquid from the shaft to the housing is readily redistributed. For example, the flow of liquid is redistributed to provide a greater amount of liquid to the ends of the brush than to the center of the brush.

Abstract: A brush assembly includes a distributor having a slot matrix formed in an outer surface of the distributor, the slot matrix including a plurality of longitudinal slots intersecting a plurality of annular slots. The brush assembly further includes a housing having an inner surface abutting the outer surface of the distributor, a brush mounted on the housing and a shaft. During use, the flow of liquid from the shaft to the housing flows through the longitudinal slots and annular slots of the distributor. By appropriately selecting the dimensions and numbers of these slots, the flow of liquid from the shaft to the housing is readily redistributed. For example, the flow of liquid is redistributed to provide a greater amount of liquid to the ends of the brush than to the center of the brush.