Abstract: Systems and methods for heating and cooling a vehicle using a heat pump are disclosed herein. In one embodiment, a system for heating and cooling the vehicle includes a heat pump having: a compressor located in an engine compartment of the vehicle, and an evaporator located in a sleeper or a cab of the vehicle. The system also includes a controller for selecting a cooling mode or a heating mode for the heat pump.

Abstract: Systems and methods for heating and cooling a vehicle using a heat pump are disclosed herein. In one embodiment, a system for heating and cooling the vehicle includes a heat pump having: a compressor located in an engine compartment of the vehicle, and an evaporator located in a sleeper or a cab of the vehicle. The system also includes a controller for selecting a cooling mode or a heating mode for the heat pump. In one embodiment, the system includes a clutch for engaging the compressor with a transmission of the vehicle.

Abstract: Systems and methods for heating and cooling a vehicle using a heat pump are disclosed herein. In one embodiment, a system for heating and cooling the vehicle includes a heat pump having: a compressor located in an engine compartment of the vehicle, and an evaporator located in a sleeper or a cab of the vehicle. The system also includes a controller for selecting a cooling mode or a heating mode for the heat pump. In one embodiment, the system includes a clutch for engaging the compressor with a transmission of the vehicle.

Abstract: An improved package device simulator for the testing of testing sockets, the package device simulator being formed of a first layer of non-conductive rigid substrate with a second layer formed of a plurality of electrically conductive traces being added thereto. A third layer of non-conductive rigid substrate is adhered to the first layer with the second layer being sealed there between. The third layer having a plurality of openings therein, wherein the openings align with and expose a portion of the electrically conductive traces of the second layer. Conductive binding material and contact balls are added to the openings and the chip is cured thereby fusing the contact balls with the exposed portions of the traces. Next, the exposed surfaces are coated with a hardening conductive material, such as layers of Nickel and/or Gold. In this way an improved package device simulator is formed that is durable, easier to manufacture and less expensive than a solid metallic package device simulator.

Abstract: A cutting board system that includes a cutting surface that removeably cooperates with at least one side of a base portion of the cutting board system. In a preferred aspect, the cutting surface includes a cutting layer and an indicator layer that underlies the cutting layer. Exposure of the indicator layer provides an indication as to degradation or use of the cutting layer and is indicative of desired replacement of the cutting surface. In a more preferred embodiment, respective cutting layers are associated with the generally opposite sides of the indicator layer such that the cutting surface is reversible.

Abstract: A cutting board system that includes a cutting surface that removeably cooperates with at least one side of a base portion of the cutting board system. In a preferred aspect, the cutting surface includes a cutting layer and an indicator layer that underlies the cutting layer. Exposure of the indicator layer provides an indication as to degradation or use of the cutting layer and is indicative of desired replacement of the cutting surface. In a more preferred embodiment, respective cutting layers are associated with the generally opposite sides of the indicator layer such that the cutting surface is reversible.

Abstract: Systems and methods for heating and cooling a vehicle using a heat pump are disclosed herein. In one embodiment, a system for heating and cooling the vehicle includes a heat pump having: a compressor located in an engine compartment of the vehicle, and an evaporator located in a sleeper or a cab of the vehicle. The system also includes a controller for selecting a cooling mode or a heating mode for the heat pump. In one embodiment, the system includes a clutch for engaging the compressor with a transmission of the vehicle.

Abstract: A cutting board system that includes a cutting surface that removeably cooperates with at least one side of a base portion of the cutting board system. In a preferred aspect, the cutting surface includes a cutting layer and an indicator layer that underlies the cutting layer. Exposure of the indicator layer provides an indication as to degradation or use of the cutting layer and is indicative of desired replacement of the cutting surface. In a more preferred embodiment, respective cutting layers are associated with the generally opposite sides of the indicator layer such that the cutting surface is reversible.

Abstract: A cutting board system that includes a cutting surface that removeably cooperates with at least one side of a base portion of the cutting board system. In a preferred aspect, the cutting surface includes a cutting layer and an indicator layer that underlies the cutting layer. Exposure of the indicator layer provides an indication as to degradation or use of the cutting layer and is indicative of desired replacement of the cutting surface. In a more preferred embodiment, respective cutting layers are associated with the generally opposite sides of the indicator layer such that the cutting surface is reversible.

Abstract: An improved package device simulator for the testing of testing sockets, the package device simulator being formed of a first layer of non-conductive rigid substrate with a second layer formed of a plurality of electrically conductive traces being added thereto. A third layer of non-conductive rigid substrate is adhered to the first layer with the second layer being sealed there between. The third layer having a plurality of openings therein, wherein the openings align with and expose a portion of the electrically conductive traces of the second layer. Conductive binding material and contact balls are added to the openings and the chip is cured thereby fusing the contact balls with the exposed portions of the traces. Next, the exposed surfaces are coated with a hardening conductive material, such as layers of Nickel and/or Gold. In this way an improved package device simulator is formed that is durable, easier to manufacture and less expensive than a solid metallic package device simulator.

Abstract: A Process Control and Governance method is used to manage the entire process flow into several sub-processes. The process is overseen and managed by one Process Initiator, and is distributed to a layered execution structure consisting of a plurality of Process Executors. The Process Initiator and the Process Executors in all layers send messages corresponding to the tasks to a database system via a sending program. The database shows latest messages of all the processes, so that the Process Initiator can inquire and understand the latest progress of the processes in time.

Abstract: The present invention relates to a method in which a microbial fuel cell (MFC) is used in order to produce electrical power while also either eliminating heavy metals or recovering precious metals from wastewater containing the heavy metals or the precious metals, and, more particularly, the invention has advantages including effective elimination of Hg2+ or any other heavy metals in the form of a solid precipitate or deposit of Hg or Hg2Cl2 or any other such deposits or effective recovery of Ag or any other precious metals in the form of solid precipitates or deposits, and incidentally, power is produced, by-products are rendered harmless and long-term economic operation is achieved.

Abstract: A container for carrying and pouring flowable materials having a bucket portion with a side portion, a closed bottom portion and an upper rim area at least partially defining an open top; a handle attached near or on the upper rim area; at least three gripping surfaces located in the closed bottom portion of the bucket portion to permit multiple means of gripping the container. A method for dispensing flowable materials having the steps of gripping a handle rotatably affixed to a container having material therein with a first hand, wherein at least a portion of the handle is located above a discharge opening of the container; gripping a gripping surface located about the middle of the bottom of the container with a second hand; and tipping the container to discharge material from within the container using the first hand and the handle as a pivot point while lifting the bottom of the container with the second hand gripping the gripping surface.

Abstract: A container for carrying and pouring flowable materials having a bucket portion with a side portion, a closed bottom portion and an upper rim area at least partially defining an open top; a handle attached near or on the upper rim area; at least three gripping surfaces located in the closed bottom portion of the bucket portion to permit multiple means of gripping the container. A method for dispensing flowable materials having the steps of gripping a handle rotatably affixed to a container having material therein with a first hand, wherein at least a portion of the handle is located above a discharge opening of the container; gripping a gripping surface located about the middle of the bottom of the container with a second hand; and tipping the container to discharge material from within the container using the first hand and the handle as a pivot point while lifting the bottom of the container with the second hand gripping the gripping surface.

Abstract: Preferred embodiments of the present invention comprise a system and method for providing mortgage and/or credit services over the Internet. In one embodiment, a preferred method comprises: (a) selectively providing information concerning a plurality of mortgage and/or credit programs to an Internet-connected user; (b) receiving an indication of whether the user wishes to explore home financing options or home equity loan options; (c) receiving an indication of whether the user maintains an asset and/or brokerage account with a sponsor of the mortgage and/or credit services; (d) receiving an indication of the user's residence; (e) receiving information concerning a property to be financed, (f) receiving information concerning the user's investments; (g) processing the received information to determine mortgage and/or credit options that correspond to the user's needs; and (h) presenting those mortgage and/or credit options to the user via the Internet.