Patents by Inventor Mikel Andonegi Aldaz

Mikel Andonegi Aldaz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multisiphon passive cooling system
    Patent number: 10590916
    Abstract: A cooling system includes one or more heat generating components located within an enclosure. A first conduit is thermally connected to one or more of the heat generating components, and the first conduit is fluidly connected to a distribution manifold and a condensing unit. The condensing unit is located external to the enclosure and above the heat generating components. The distribuition manifold is located below the heat generating components. A second conduit is fluidly connected to the condensing unit and the distribution manifold. The cooling system includes a two-phase cooling medium. The first conduit, condensing unit, second conduit and distribution manifold form a loop in which the cooling medium circulates.
    Type: Grant
    Filed: January 22, 2018
    Date of Patent: March 17, 2020
    Assignee: General Electric Company
    Inventors: Alistair Martin Waddell, Mark Aaron Chan, Mikel Andonegi Aldaz
  • MULTISIPHON PASSIVE COOLING SYSTEM
    Publication number: 20190226461
    Abstract: A cooling system includes one or more heat generating components located within an enclosure. A first conduit is thermally connected to one or more of the heat generating components, and the first conduit is fluidly connected to a distribution manifold and a condensing unit. The condensing unit is located external to the enclosure and above the heat generating components. The distribuition manifold is located below the heat generating components. A second conduit is fluidly connected to the condensing unit and the distribution manifold. The cooling system includes a two-phase cooling medium. The first conduit, condensing unit, second conduit and distribution manifold form a loop in which the cooling medium circulates.
    Type: Application
    Filed: January 22, 2018
    Publication date: July 25, 2019
    Applicant: General Electric Company
    Inventors: Alistair Martin Waddell, Mark Aaron Chan, Mikel Andonegi Aldaz