Abstract: Semiconductor wafer handling equipment is cleaned and rinsed in a sealed first chamber. Thereafter, the first chamber is unsealed and the handling equipment is moved into a second chamber so that only the handling equipment is introduced into the second chamber. The second chamber is then sealed and the handling equipment is dried therein and thereafter subjected to a stream of ionized gas to eliminate static charge therefrom.

Abstract: Apparatus for decontaminating certain types of semiconductor wafer handling equipment is disclosed. The apparatus includes a frame having structure for applying decontaminating and electrostatic elimination fluid to handling equipment. It includes a first chamber and a second chamber. The first chamber removes contaminants from handling equipment and restricts the removed contaminants to the first chamber. The second chamber includes structure for drying handling equipment. The apparatus further includes structure for removing static from dried handling equipment.