Patents by Inventor Mikhail Pevzner
Mikhail Pevzner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230209728Abstract: A process of fabricating an electromagnetic circuit includes providing three laminate sheets, forming a first feature in a first laminate sheet of the three laminate sheets, and forming a second feature in a second laminate sheet of the three laminate sheets. The second feature is aligned with the first feature when aligning the second laminate sheet with the first laminate sheet. The process further includes stacking the three laminate sheets so that the first laminate sheet is positioned above and aligned with the second laminate sheet and the second laminate sheet is positioned above and aligned with the third laminate sheet. The first feature and the second feature define a contiguous element. The process further includes filling the contiguous element with an electrically conductive material to form an electrically continuous conductor.Type: ApplicationFiled: February 23, 2023Publication date: June 29, 2023Inventors: Mikhail Pevzner, Gregory G. Beninati, James E. Benedict, Andrew R. Southworth
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Publication number: 20230170599Abstract: A compressible dielectric standoff configured to mount at least one antenna on a ground plane of an antenna assembly includes a ground plane end configured to contact the ground plane and at least one antenna end configured to contact the at least one antenna. The compressible dielectric standoff is movable between a compressed state in which the ground plane end is spaced apart from the at least one antenna end a first distance, and an expanded state in which the ground plane end is spaced apart from the at least one antenna end a second distance. The first distance is smaller than the second distance.Type: ApplicationFiled: September 2, 2022Publication date: June 1, 2023Inventors: Channing Paige Favreau, Mikhail Pevzner, Alexander T. Gilbert, Thomas V. Sikina
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Patent number: 11653484Abstract: An apparatus to automatically place layers of a printed circuit board on a fixture includes a robotic device having a base that is secured to a surface, an upright column that extends upwardly from the base, and a movable arm rotatably coupled to the upright column. The movable arm is configured to rotate about a vertical axis defined by the upright column. The movable arm is further configured to rotate from a position in which the movable arm is disposed over a laminate sheet fixture and to pick up a laminate sheet to a position in which the movable arm is disposed over a board layup fixture to deposit the laminate sheet in the board layup fixture, and from a position in which the movable arm is disposed over a bond film fixture and to pick up a bond film to a position in which the movable arm is disposed over the board layup fixture to deposit the bond film in the board layup fixture.Type: GrantFiled: November 8, 2019Date of Patent: May 16, 2023Assignee: RAYTHEON COMPANYInventors: Mikhail Pevzner, James E. Benedict, Andrew R. Southworth, Wade A. Schwanda
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Patent number: 11606865Abstract: A process of fabricating an electromagnetic circuit includes providing three laminate sheets, forming a first feature in a first laminate sheet of the three laminate sheets, and forming a second feature in a second laminate sheet of the three laminate sheets. The second feature is aligned with the first feature when aligning the second laminate sheet with the first laminate sheet. The process further includes stacking the three laminate sheets so that the first laminate sheet is positioned above and aligned with the second laminate sheet and the second laminate sheet is positioned above and aligned with the third laminate sheet. The first feature and the second feature define a contiguous element. The process further includes filling the contiguous element with an electrically conductive material to form an electrically continuous conductor.Type: GrantFiled: November 8, 2019Date of Patent: March 14, 2023Assignee: RAYTHEON COMPANYInventors: Mikhail Pevzner, Gregory G. Beninati, James E. Benedict, Andrew R. Southworth
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Patent number: 11497118Abstract: A method of fabricating a printed circuit assembly includes providing a flexible-hybrid circuit having a base and at least one side panel. The at least one side panel is hingedly connected to the base. The method further includes disposing a support structure on the flexible-hybrid circuit. The support structure includes a base, which is disposed on the base of the flexible-hybrid circuit, and at least one side that corresponds to the at least one side panel of the flexible-hybrid circuit. The method further includes folding the at least one side panel of the flexible-hybrid circuit so that the at least one side panel is disposed co-planar with the at least one side of the support structure to create a printed circuit assembly.Type: GrantFiled: February 12, 2021Date of Patent: November 8, 2022Assignee: RAYTHEON COMPANYInventors: Channing Paige Favreau, James E. Benedict, Mikhail Pevzner, Thomas V. Sikina
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Patent number: 11470725Abstract: An apparatus for automating the fabrication of a copper vertical launch (CVL) within a printed circuit board (PCB) includes a feed mechanism to feed and extrude copper wire from a spool of copper wire and a wire cutting and gripping mechanism to receive copper wire from the feed mechanism, cut and secure a segment of copper wire, insert the segment of copper wire into a hole formed within the PCB, solder an end of the segment of copper wire to a signal trace of the PCB, and flush cut an opposite end of the segment of the copper wire to a surface of the PCB. The wire cutting and gripping mechanism includes a wire cutter to flush cut the segment of copper wire and an integrated heated gripper device to receive the copper wire from the spool of copper wire and cut and grab a segment from copper wire.Type: GrantFiled: August 6, 2021Date of Patent: October 11, 2022Assignee: RAYTHEON COMPANYInventors: Mikhail Pevzner, James E. Benedict, Andrew R. Southworth, Thomas V. Sikina, Kevin Wilder, Matthew Souza, Aaron Michael Torberg
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Publication number: 20220264745Abstract: A method of fabricating a printed circuit assembly includes providing a flexible-hybrid circuit having a base and at least one side panel. The at least one side panel is hingedly connected to the base. The method further includes disposing a support structure on the flexible-hybrid circuit. The support structure includes a base, which is disposed on the base of the flexible-hybrid circuit, and at least one side that corresponds to the at least one side panel of the flexible-hybrid circuit. The method further includes folding the at least one side panel of the flexible-hybrid circuit so that the at least one side panel is disposed co-planar with the at least one side of the support structure to create a printed circuit assembly.Type: ApplicationFiled: February 12, 2021Publication date: August 18, 2022Inventors: Channing Paige Favreau, James E. Benedict, Mikhail Pevzner, Thomas V. Sikina
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Publication number: 20220254750Abstract: Methods and apparatus for providing an interconnection including a stack of wirebond balls having a selected impedance. The wirebond balls may have a size, which may comprise a radius, configured for the selected impedance. The stack may comprise a number of wirebond balls configured for the selected impedance and/or may comprise a material selected for the selected impedance. In embodiments, the selected impedance is primarily resistive (e.g., 50 Ohms), such that the overall reactance is minimized.Type: ApplicationFiled: February 5, 2021Publication date: August 11, 2022Applicant: Raytheon CompanyInventors: Patrick E. Boyle, James E. Benedict, Erika Klek, Mikhail Pevzner
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Patent number: 11317502Abstract: Methods and apparatus for providing a cavity defined by conductive walls, a printed circuit board (PCB) within the cavity, and shorting posts extending into the cavity to suppress higher order modes generated by operation of the PCB.Type: GrantFiled: May 15, 2020Date of Patent: April 26, 2022Assignee: Raytheon CompanyInventors: Thomas V. Sikina, John P. Haven, James E. Benedict, William J. Clark, Channing P. Favreau, Erika Klek, Mikhail Pevzner, Donald G. Hersey, Gregory G. Beninati, Thomas J. Tellinghuisen
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Publication number: 20210400820Abstract: A process of fabricating a circuit includes providing a first sheet of dielectric material including a first top surface having at least one first conductive trace and a second sheet of dielectric material including a second top surface having at least one second conductive trace, depositing a first solder bump on the at least one first conductive trace, applying the second sheet of dielectric material to the first sheet of dielectric material with bonding film sandwiched in between, bonding the first and second sheets of dielectric material to one another, and providing a conductive material to connect the first solder bump on the at least one first conductive trace to the at least one second conductive trace.Type: ApplicationFiled: September 2, 2021Publication date: December 23, 2021Inventors: James E. Benedict, Gregory G. Beninati, Mikhail Pevzner, Thomas V. Sikina, Andrew R. Southworth
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Publication number: 20210368629Abstract: An apparatus for automating the fabrication of a copper vertical launch (CVL) within a printed circuit board (PCB) includes a feed mechanism to feed and extrude copper wire from a spool of copper wire and a wire cutting and gripping mechanism to receive copper wire from the feed mechanism, cut and secure a segment of copper wire, insert the segment of copper wire into a hole formed within the PCB, solder an end of the segment of copper wire to a signal trace of the PCB, and flush cut an opposite end of the segment of the copper wire to a surface of the PCB. The wire cutting and gripping mechanism includes a wire cutter to flush cut the segment of copper wire and an integrated heated gripper device to receive the copper wire from the spool of copper wire and cut and grab a segment from copper wire.Type: ApplicationFiled: August 6, 2021Publication date: November 25, 2021Inventors: Mikhail Pevzner, James E. Benedict, Andrew R. Southworth, Thomas V. Sikina, Kevin Wilder, Matthew Souza, Aaron Michael Torberg
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Publication number: 20210360772Abstract: Methods and apparatus for providing a cavity defined by conductive walls, a printed circuit board (PCB) within the cavity, and shorting posts extending into the cavity to suppress higher order modes generated by operation of the PCB.Type: ApplicationFiled: May 15, 2020Publication date: November 18, 2021Applicant: Raytheon CompanyInventors: Thomas V. Sikina, John P. Haven, James E. Benedict, William J. Clark, Channing P. Favreau, Erika Klek, Mikhail Pevzner, Donald G. Hersey, Gregory G. Beninati, Thomas J. Tellinghuisen
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Patent number: 11171101Abstract: A process of fabricating an electromagnetic circuit includes providing a first sheet of dielectric material including a top surface having at least one conductive trace and depositing a solder bump on the at least one conductive trace. The process further includes applying a second sheet of dielectric material to the first sheet of dielectric material with bond film sandwiched in between, the second sheet of dielectric material having a through-hole providing access to the solder bump. The process further includes bonding the first and second dielectric materials to one another and removing bond film resin from the solder bump. The process further includes machining the solder bump by the drilling or milling process to achieve a desired amount of solder in the solder bump.Type: GrantFiled: March 31, 2020Date of Patent: November 9, 2021Assignee: RAYTHEON COMPANYInventors: James E. Benedict, Paul A. Danello, Mikhail Pevzner, Thomas V. Sikina, Andrew R. Southworth
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Publication number: 20210305187Abstract: A process of fabricating an electromagnetic circuit includes providing a first sheet of dielectric material including a top surface having at least one conductive trace and depositing a solder bump on the at least one conductive trace. The process further includes applying a second sheet of dielectric material to the first sheet of dielectric material with bond film sandwiched in between, the second sheet of dielectric material having a through-hole providing access to the solder bump. The process further includes bonding the first and second dielectric materials to one another and removing bond film resin from the solder bump. The process further includes machining the solder bump by the drilling or milling process to achieve a desired amount of solder in the solder bump.Type: ApplicationFiled: March 31, 2020Publication date: September 30, 2021Inventors: James E. Benedict, Paul A. Danello, Mikhail Pevzner, Thomas V. Sikina, Andrew R. Southworth
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Patent number: 11122692Abstract: A process of fabricating a circuit includes providing a first sheet of dielectric material including a first top surface having at least one first conductive trace and a second sheet of dielectric material including a second top surface having at least one second conductive trace, depositing a first solder bump on the at least one first conductive trace, applying the second sheet of dielectric material to the first sheet of dielectric material with bonding film sandwiched in between, bonding the first and second sheets of dielectric material to one another, and providing a conductive material to connect the first solder bump on the at least one first conductive trace to the at least one second conductive trace.Type: GrantFiled: June 11, 2020Date of Patent: September 14, 2021Assignee: RAYTHEON COMPANYInventors: James E. Benedict, Gregory G. Beninati, Mikhail Pevzner, Thomas V. Sikina, Andrew R. Southworth
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Patent number: 11109489Abstract: An apparatus for automating the fabrication of a copper vertical launch (CVL) within a printed circuit board (PCB) includes a feed mechanism to feed and extrude copper wire from a spool of copper wire and a wire cutting and gripping mechanism to receive copper wire from the feed mechanism, cut and secure a segment of copper wire, insert the segment of copper wire into a hole formed within the PCB, solder an end of the segment of copper wire to a signal trace of the PCB, and flush cut an opposite end of the segment of the copper wire to a surface of the PCB. The wire cutting and gripping mechanism includes a wire cutter to flush cut the segment of copper wire and an integrated heated gripper device to receive the copper wire from the spool of copper wire and cut and grab a segment from copper wire.Type: GrantFiled: August 15, 2019Date of Patent: August 31, 2021Assignee: RAYTHEON COMPANYInventors: Mikhail Pevzner, James E. Benedict, Andrew R. Southworth, Thomas V. Sikina, Kevin Wilder, Matthew Souza, Aaron Michael Torberg
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Publication number: 20210144864Abstract: A process of fabricating an electromagnetic circuit includes providing three laminate sheets, forming a first feature in a first laminate sheet of the three laminate sheets, and forming a second feature in a second laminate sheet of the three laminate sheets. The second feature is aligned with the first feature when aligning the second laminate sheet with the first laminate sheet. The process further includes stacking the three laminate sheets so that the first laminate sheet is positioned above and aligned with the second laminate sheet and the second laminate sheet is positioned above and aligned with the third laminate sheet. The first feature and the second feature define a contiguous element. The process further includes filling the contiguous element with an electrically conductive material to form an electrically continuous conductor.Type: ApplicationFiled: November 8, 2019Publication date: May 13, 2021Inventors: Mikhail Pevzner, Gregory G. Beninati, James E. Benedict, Andrew R. Southworth
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Publication number: 20210144892Abstract: An apparatus to automatically place layers of a printed circuit board on a fixture includes a robotic device having a base that is secured to a surface, an upright column that extends upwardly from the base, and a movable arm rotatably coupled to the upright column. The movable arm is configured to rotate about a vertical axis defined by the upright column. The movable arm is further configured to rotate from a position in which the movable arm is disposed over a laminate sheet fixture and to pick up a laminate sheet to a position in which the movable arm is disposed over a board layup fixture to deposit the laminate sheet in the board layup fixture, and from a position in which the movable arm is disposed over a bond film fixture and to pick up a bond film to a position in which the movable arm is disposed over the board layup fixture to deposit the bond film in the board layup fixture.Type: ApplicationFiled: November 8, 2019Publication date: May 13, 2021Inventors: Mikhail Pevzner, James E. Benedict, Andrew R. Southworth, Wade A. Schwanda
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Patent number: 10999938Abstract: Methods and apparatus for an assembly having first and second circuit cards mated together with a ball stack on the first circuit card extending into a through hole in the second circuit card. A wirebond connects the first ball stack to a bond pad on the first surface of the second circuit card forming a low profile connector-less interconnect. The ball stack comprises at least two balls stacked on top of each other and bonded to each other, wherein the balls are generated from wire.Type: GrantFiled: April 29, 2020Date of Patent: May 4, 2021Assignee: Raytheon CompanyInventors: Mikhail Pevzner, Donald G. Hersey, Gregory G. Beninati, Thomas J. Tellinghuisen, James E. Benedict
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Publication number: 20210051805Abstract: An apparatus for automating the fabrication of a copper vertical launch (CVL) within a printed circuit board (PCB) includes a feed mechanism to feed and extrude copper wire from a spool of copper wire and a wire cutting and gripping mechanism to receive copper wire from the feed mechanism, cut and secure a segment of copper wire, insert the segment of copper wire into a hole formed within the PCB, solder an end of the segment of copper wire to a signal trace of the PCB, and flush cut an opposite end of the segment of the copper wire to a surface of the PCB. The wire cutting and gripping mechanism includes a wire cutter to flush cut the segment of copper wire and an integrated heated gripper device to receive the copper wire from the spool of copper wire and cut and grab a segment from copper wire.Type: ApplicationFiled: August 15, 2019Publication date: February 18, 2021Inventors: Mikhail Pevzner, James E. Benedict, Andrew R. Southworth, Thomas V. Sikina, Kevin Wilder, Matthew Souza, Aaron Michael Torberg