Patents by Inventor MIKHAIL PYLNEV

MIKHAIL PYLNEV has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Inspection method for multilayer semiconductor device
    Patent number: 11313670
    Abstract: An inspection method for a multilayer semiconductor device is provided. The inspection method can investigate multilayered ensembles of a multilayer semiconductor device and obtain stratigraphic thickness (ST) maps of each layer in the multilayer semiconductor device by utilizing absorption edges of materials of interests and obtaining calibration quality curves.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: April 26, 2022
    Assignee: NATIONAL TSING HUA UNIVERSITY
    Inventors: Mikhail Pylnev, Tzu-Chien Wei, Duc-Anh Le
  • INSPECTION METHOD FOR MULTILAYER SEMICONDUCTOR DEVICE
    Publication number: 20220099432
    Abstract: An inspection method for a multilayer semiconductor device is provided. The inspection method can investigate multilayered ensembles of a multilayer semiconductor device and obtain stratigraphic thickness (ST) maps of each layer in the multilayer semiconductor device by utilizing absorption edges of materials of interests and obtaining calibration quality curves.
    Type: Application
    Filed: September 30, 2020
    Publication date: March 31, 2022
    Inventors: MIKHAIL PYLNEV, TZU-CHIEN WEI, DUC-ANH LE