Abstract: The apparatus comprises a plating unit, the cavity of which communicates with a plating solution feed system, and pressing means mounted above the plating unit. The pressing means according to the invention is made in the form of a magazine with two or more pressure surfaces whereon sealing members, workpiece orientation members and workpiece retaining members are mounted. The magazine is operatively connected to a vertical movement actuator in a manner which provides for rotation of the magazine about its horizontal axis. A masking member is mounted on the surface of the plating unit to mask the workpiece surface areas not to be plated. The apparatus comprises an anode which is mounted in the internal space or cavity of the plating unit in the path of the plating solution flowing towards the workpiece, and a cathode connected to the workpiece.