Patents by Inventor Miki Hasegawa

Miki Hasegawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7841862
    Abstract: To provide a dielectric sheet that can be used as an elastomer connector in order to connect highly integrated circuit board and fine pitch electronic parts. The dielectric sheet (10f) comprises a first penetrating region (222c) having high permittivity, and a second penetrating region (33a) having conductivity, the regions are arranged and formed in such a way that they are alternatively interspersed in longitudinal and crosswise directions in a non-conductive sheet-shaped elastomer. The transverse thickness W2 and longitudinal thickness W5 in the first penetrating region (222c) may be arbitrarily determined. Similarly, the transverse thickness W3 and longitudinal thickness W5 in the second penetrating region (33a) may be arbitrarily determined. The dielectric sheet (10f) serves to compliment the circuit of electronic parts (for example, the printing board) to be connected thereto.
    Type: Grant
    Filed: February 27, 2004
    Date of Patent: November 30, 2010
    Assignee: J.S.T. Mfg. Co., Ltd.
    Inventor: Miki Hasegawa
  • Publication number: 20090078449
    Abstract: To provide a dielectric sheet that can be used as an elastomer connector in order to connect highly integrated circuit board and fine pitch electronic parts. The dielectric sheet (10f) comprises a first penetrating region (222c) having high permittivity, and a second penetrating region (33a) having conductivity, the regions are arranged and formed in such a way that they are alternatively interspersed in longitudinal and crosswise directions in a non-conductive sheet-shaped elastomer. The transverse thickness W2 and longitudinal thickness W5 in the first penetrating region (222c) may be arbitrarily determined. Similarly, the transverse thickness W3 and longitudinal thickness W5 in the second penetrating region (33a) may be arbitrarily determined. The dielectric sheet (10f) serves to compliment the circuit of electronic parts (for example, the printing board) to be connected thereto.
    Type: Application
    Filed: February 27, 2004
    Publication date: March 26, 2009
    Inventor: Miki Hasegawa
  • Patent number: 7465491
    Abstract: An anisotropic conductive sheet interposed between a circuit board such as a substrate and various circuit parts to render them conductive and its manufacturing method. The anisotropic conductive sheet has a fine pitch required by the recent highly integrated circuit boards and electronic parts. In the anisotropic conductive sheet in which conductive members are scattered in a nonconductive matrix, the conductive members (e.g., 24) penetrate through the sheet (10) in the direction of thickness and conductive auxiliary layers (e.g., 25) are in contact with the conductive members (e.g., 24).
    Type: Grant
    Filed: March 20, 2003
    Date of Patent: December 16, 2008
    Assignee: J.S.T. Mfg. Co., Ltd.
    Inventors: Miki Hasegawa, Takeshi Watanabe
  • Publication number: 20080064778
    Abstract: The present invention provides a manufacturing method of a rigid polyurethane foam for a heat insulation material that satisfies performance required for practical use, such as a low thermal conductivity over a long period, and excellent adhesiveness and excellent dimensional stability under a low temperature environment. The manufacturing method of a rigid polyurethane foam for a heat insulation material, which is formed from blowing and molding using a mixture that includes polyisocyanate, a polyol, and a blowing agent, wherein a polyol prepared by addition-polymerizing ethylene oxide and propylene oxide to an aromatic monoamine compound or an aromatic diol compound.
    Type: Application
    Filed: September 30, 2005
    Publication date: March 13, 2008
    Applicant: TOHO CHEMICAL INDUSTRY CO., LTD.
    Inventors: Miki Hasegawa, Tadashi Okawa, Tomohiro Noguchi
  • Patent number: 7304390
    Abstract: An anisotropic conductive sheet manufactured through improved manufacturing steps and a method of manufacturing the same. Conductive portions are unevenly arranged in a nonconductive elastomer having fluidity and serving as a matrix, the conductive portions highly densely containing the conductive particles having a specific gravity greater than that of the matrix component, the conductive particles are unevenly dispersed to form substantially nonconductive portions, and the conductive portions and the nonconductive portions are integrally cured to mold anisotropic conductive pieces. The anisotropic conductive pieces are so laminated that the conductive portions and the nonconductive portions are alternately arranged thereby to obtain a first laminate, and the first laminate is cut maintaining a predetermined thickness to obtain a zebra-like sheet.
    Type: Grant
    Filed: March 4, 2005
    Date of Patent: December 4, 2007
    Assignee: J.S.T. Mfg. Co., Ltd
    Inventor: Miki Hasegawa
  • Patent number: 7264482
    Abstract: An anisotropic conductive sheet capable of transmitting high-speed digital signals reliably is provided. The anisotropic conductive sheet has a conductive property in a thickness direction thereof under a predetermined condition, and includes: insulative matrix members having a dielectric constant value of at most 2.28 and a dielectric loss value of at most 0.025; and conductive members having a conductive property in the thickness direction under the predetermined condition in the conductive members capable of flowing electricity between top and bottom surfaces thereof are located in a scattered manner in the matrix members, and the conductive and matrix members are bonded chemically. Especially, the matrix member is made from a resin material having a resin foamed body of a foaming structure, i.e. homogeneous microcell structure. At least one of the conductive members may be of conductive elastomer.
    Type: Grant
    Filed: March 9, 2005
    Date of Patent: September 4, 2007
    Assignee: J.S.T. Mfg. Co., Ltd.
    Inventor: Miki Hasegawa
  • Patent number: 7244127
    Abstract: An anisotropic conductive sheet interposed between a circuit board such as a substrate and various circuit parts to render them conductive and its manufacturing method. The anisotropic conductive sheet has a fine pitch required by the recent highly integrated circuit boards and electronic parts, and exhibits conductivity in only the direction of thickness of the sheet due to the use of conductive thin layers such as of a metal which does not slip out. The anisotropic conductive sheet (10) includes conductive thin layers (30) that are scattering in the direction of plane of the anisotropic conductive sheet (10) and are penetrating through in the direction of thickness of the anisotropic conductive sheet (10).
    Type: Grant
    Filed: March 20, 2003
    Date of Patent: July 17, 2007
    Assignee: J.S.T. Mfg. Co., Ltd.
    Inventor: Miki Hasegawa
  • Publication number: 20060162287
    Abstract: An anisotropic conductive sheet for high frequencies is provided as elastomer for connecting high-integrated circuit boards and fine pitch electronic components of recent years. Anisotropic conductive sheet (30) has a sheet-shaped elastomer (1c), and a non-conductive rectangular first penetrating region (11) is formed vertically and horizontally in a state surrounded by the sheet-shaped elastomer (1c). In addition, an electrically-conductive second penetrating region (12) is formed in a rectangular manner in a state surrounded by the first penetrating region (11). The first penetrating region 11 can be a high-dielectric rectangular third penetrating region. The anisotropic conductive sheet (30) has an effect in that electrostatic shield is provided between connected electronic components.
    Type: Application
    Filed: February 27, 2004
    Publication date: July 27, 2006
    Inventor: Miki Hasegawa
  • Publication number: 20050233620
    Abstract: The present invention relates to an anisotropic conductive sheet, which is interposed between a circuit board such as a substrate and various circuit parts to render conductive paths and a manufacturing method thereof, providing the anisotropic conductive sheet securing a fine pitch anisotropic conductivity required by the recent highly integrated circuit boards and electronic parts yet keeping high durability of the conductive member. The anisotropic conductive sheet (10) is constituted by alternately arranging strip-like members (14) of a striped pattern having conductive pieces (24) and nonconductive pieces (22) alternately arranged, and nonconductive strip-like members (12).
    Type: Application
    Filed: March 20, 2003
    Publication date: October 20, 2005
    Inventor: Miki Hasegawa
  • Publication number: 20050224762
    Abstract: A conductive layer that can be easily handled having good electric conductivity and an anisotropic conductive sheet obtained by adhering the conductive layer to a base member made of a conductive member. A flexible good conductive layer comprises a plurality of layers and is adhered to the base member so will not to be broken even when the base member is distorted due to the handling. The flexible good conductive layer (25) can be adhered to a base member (24) made of a flexible material, and is constituted by at least a set of a layer (e.g., 254) of a flexible material, and a layer (e.g., 256) of a material having good conductivity and is electrically contacted to the layer (e.g., 254) made of the flexible material. The flexible good conductive layer (25) is adhered to the anisotropic conductive sheet (10) in which the conductive members (24) are scattered in the nonconductive matrix, and the flexible good conductive layer (25) is contacted to the conductive members (24).
    Type: Application
    Filed: March 20, 2003
    Publication date: October 13, 2005
    Applicant: J.S.T. Mfg. Co., Ltd.
    Inventor: Miki Hasegawa
  • Publication number: 20050221645
    Abstract: The present invention relates to an anisotropically conductive block, which establishes electrical continuity between electric terminals when it is interposed between the terminals, and its manufacturing method and is aimed at providing an anisotropically conductive block capable of offering conductivity independently in multi-directions. The anisotropically conductive block (10) is configured by arranging conductive paths (e.g. (24) and (44)) while dislocating the paths in Z direction, wherein the conductive paths are non-conductive in a certain direction (Z direction) and have conductivity in a plurality of directions, in directions substantially in parallel with a plane (X-Y plane) perpendicular to Z direction.
    Type: Application
    Filed: March 20, 2003
    Publication date: October 6, 2005
    Inventor: Miki Hasegawa
  • Publication number: 20050201034
    Abstract: An anisotropic conductive sheet capable of transmitting high-speed digital signals reliably is provided. The anisotropic conductive sheet has a conductive property in a thickness direction thereof under a predetermined condition, and includes: insulative matrix members having a dielectric constant value of at most 2.28 and a dielectric loss value of at most 0.025; and conductive members having a conductive property in the thickness direction under the predetermined condition in the conductive members capable of flowing electricity between top and bottom surfaces thereof are located in a scattered manner in the matrix members, and the conductive and matrix members are bonded chemically. Especially, the matrix member is made from a resin material having a resin foamed body of a foaming structure, i.e. homogeneous microcell structure. At least one of the conductive members may be of conductive elastomer.
    Type: Application
    Filed: March 9, 2005
    Publication date: September 15, 2005
    Inventor: Miki Hasegawa
  • Publication number: 20050194697
    Abstract: An anisotropic conductive sheet manufactured through improved manufacturing steps and a method of manufacturing the same. Conductive portions are unevenly arranged in a nonconductive elastomer having fluidity and serving as a matrix, the conductive portions highly densely containing the conductive particles having a specific gravity greater than that of the matrix component, the conductive particles are unevenly dispersed to form substantially nonconductive portions, and the conductive portions and the nonconductive portions are integrally cured to mold anisotropic conductive pieces. The anisotropic conductive pieces are so laminated that the conductive portions and the nonconductive portions are alternately arranged thereby to obtain a first laminate, and the first laminate is cut maintaining a predetermined thickness to obtain a zebra-like sheet.
    Type: Application
    Filed: March 4, 2005
    Publication date: September 8, 2005
    Inventor: Miki Hasegawa
  • Publication number: 20050173731
    Abstract: An anisotropic conductive sheet interposed between a circuit board such as a substrate and various circuit parts to render them conductive and its manufacturing method. The anisotropic conductive sheet has a fine pitch required by the recent highly integrated circuit boards and electronic parts, and exhibits conductivity in only the direction of thickness of the sheet due to the use of conductive thin layers such as of a metal which does not slip out. The anisotropic conductive sheet (10) includes conductive thin layers (30) that are scattering in the direction of plane of the anisotropic conductive sheet (10) and are penetrating through in the direction of thickness of the anisotropic conductive sheet (10).
    Type: Application
    Filed: March 20, 2003
    Publication date: August 11, 2005
    Inventor: Miki Hasegawa
  • Publication number: 20050145974
    Abstract: An anisotropic conductive sheet interposed between a circuit board such as a substrate and various circuit parts to render them conductive and its manufacturing method. The anisotropic conductive sheet has a fine pitch required by the recent highly integrated circuit boards and electronic parts. In the anisotropic conductive sheet in which conductive members are scattered in a nonconductive matrix, the conductive members (e.g., 24) penetrate through the sheet (10) in the direction of thickness and conductive auxiliary layers (e.g., 25) are in contact with the conductive members (e.g., 24).
    Type: Application
    Filed: March 20, 2003
    Publication date: July 7, 2005
    Inventors: Miki Hasegawa, Takeshi Watanabe
  • Patent number: 6660044
    Abstract: The present invention provides a fiber product-treating agent which can impart an excellent wrinkle-resistant effect and an excellent durable press effect to the fiber product capable of being heated and being hardly effected with not only during wearing but also after washing. That is, the present invention provides the treating agent for imparting the durable press configuration on a fiber product by a heating treatment with e.g. an iron, which comprises a specific amount of (i) two or more compounds forming mutually a crosslinked structure by heating and/or (ii) a compound forming a self-crosslinked structure by heating, and water, wherein the content of a nonvolatile matter is 0.01 to 30%.
    Type: Grant
    Filed: March 30, 2001
    Date of Patent: December 9, 2003
    Assignee: Kao Corporation
    Inventors: Takako Igarashi, Koji Yui, Miki Hasegawa, Yasushi Yoshida
  • Publication number: 20010037529
    Abstract: The present invention provides a fiber product-treating agent which can impart an excellent wrinkle-resistant effect and an excellent durable press effect to the fiber product capable of being heated and being hardly effected with not only during wearing but also after washing. That is, the present invention provides the treating agent for imparting the durable press configuration on a fiber product by a heating treatment with e.g. an iron, which comprises a specific amount of (i) two or more compounds forming mutually a crosslinked structure by heating and/or (ii) a compound forming a self-crosslinked structure by heating, and water, wherein the content of a nonvolatile matter is 0.01 to 30%.
    Type: Application
    Filed: March 30, 2001
    Publication date: November 8, 2001
    Inventors: Takako Igarashi, Koji Yui, Miki Hasegawa, Yasushi Yoshida
  • Patent number: 5711681
    Abstract: A jumper connector (15) for connecting contact pins or posts (14) protruding from pin header (12) mounted on a printed circuit board (11) has an accessible conductive core (16) made of a conductive elastomer. Two apertures (17) extend through the conductive core so as to tightly fit on the pins or posts (14) that are to be electrically connected one to another. An insulating mantle (18) covers the accessible core (16), such that the connector is rendered simple in structure, produced inexpensively, adapted to a high density arrangement of those pins or posts, and the electric resistance of the core can be set at an easily adjustable level.
    Type: Grant
    Filed: September 20, 1996
    Date of Patent: January 27, 1998
    Assignee: Japan Solderless Terminal Mfg. Co., Inc.
    Inventor: Miki Hasegawa
  • Patent number: 5667536
    Abstract: A process is provided for making a tantalum capacitor chip which includes a tantalum chip body as well as an anode wire partially inserted into and partially projecting from the chip body. The process comprises the steps of compacting an initial divided amount of tantalum powder into an initial mass portion which is dimensionally smaller than the chip body, and compacting at least one additional divided amount of tantalum powder with the initial mass portion into the chip body. The capacitor chip thus obtained may be enclosed in a resin package to provide a surface mounting type tantalum capacitor.
    Type: Grant
    Filed: November 14, 1995
    Date of Patent: September 16, 1997
    Assignee: Rohm Co., Ltd.
    Inventor: Miki Hasegawa
  • Patent number: 5638253
    Abstract: A package-type solid electrolytic capacitor is provided which comprises a capacitor element, an insulating package body having a housing recess with an upward opening for receiving the capacitor element, and an insulating closure member for closing the opening of the housing recess. The capacitor element has an anode layer formed on one end and a cathode layer formed at least on the other end. The housing recess is formed with two internal electrodes in electrical conduction with the anode and cathode layers, respectively, of the capacitor element. The package body is externally formed with two terminal electrodes in electrical conduction with the respective internal electrodes.
    Type: Grant
    Filed: April 27, 1995
    Date of Patent: June 10, 1997
    Assignee: Rohm Co. Ltd.
    Inventor: Miki Hasegawa