Abstract: Provided is a pharmaceutical composition for enhancing intracellular ATP, including a compound represented by General Formula (I) wherein R1 represents an unsubstituted or substituted phenyl group, R2 represents a cyano group or a nitro group, R3 represents a hydrogen atom or a hydroxyl group, X represents an oxygen atom or —S(O)n—, n represents an integer of 0 to 2, and Y represents an oxygen atom or a sulfur atom, or a pharmaceutically acceptable salt thereof.

Abstract: An electronic control device includes a board including a heat sink on which a heat generation element is mounted, and a housing that is in contact with the board and dissipates heat of the heat generation element to the outside. A potential of the housing is a ground, and a potential of the heat sink is a non-ground. The board includes a first layer including a first non-ground wiring that is in direct contact with the heat sink, and a second layer including a second ground wiring that is in electrical and thermal contact with the housing. The first non-ground wiring and the second ground wiring overlap each other in plan view from a thickness direction of the board.

Abstract: An electronic control unit includes: a wiring substrate having a first surface on which a conductor wire is formed; a first electronic component that is implemented on the first surface of the wiring substrate, and has a large heat generation amount; a second electronic component that is implemented on the first surface of the wiring substrate, and has a heat generation amount smaller than the first electronic component; and a resin that covers the first electronic component, the second electronic component, and the first surface of the wiring substrate, and a second surface of the wiring substrate that is opposite to the first surface. A distance between an outer surface of the resin immediately below the first electronic component, and the second surface of the wiring substrate is longer than a distance between an outer surface of the resin immediately above the second electronic component, and the first surface of the wiring substrate.

Abstract: An electronic control device includes: an electronic component; a base thermally coupled to the electronic component; a first fan and a second fan provided on one surface of the base; a plurality of first heat-dissipating fins provided on the one surface of the base and provided in a first region including a region between the first fan and the second fan; and a plurality of second heat-dissipating fins provided on the one surface of the base and provided in a second region farther from the first and second fans than the first region. The plurality of first heat-dissipating fins have a structure for guiding a refrigerant sent by one of the first fan and the second fan toward a remaining one of the first fan and the second fan in the first region. The plurality of second heat-dissipating fins formed in the second region have a structure for guiding a refrigerant flowing in from the first fan or the second fan to a side away from each of the first fan and the second fan.

Abstract: A soldering device capable of shortening operation time of soldering and suppressing solder non-wetting is provided. A soldering device includes: a plurality of tubular solder piece guide tubes which have space therein for a solder piece supplied from a supply port to pass through; a first holding unit which holds the solder piece guide tubes; and a heating unit which heats the first holding unit. Tip end portions of the solder piece guide tubes on a soldering side are arranged on an inner side of the first holding unit.

Abstract: An electronic control unit includes: a wiring substrate having a first surface on which a conductor wire is formed; a first electronic component that is implemented on the first surface of the wiring substrate, and has a large heat generation amount; a second electronic component that is implemented on the first surface of the wiring substrate, and has a heat generation amount smaller than the first electronic component; and a resin that covers the first electronic component, the second electronic component, and the first surface of the wiring substrate, and a second surface of the wiring substrate that is opposite to the first surface. A distance between an outer surface of the resin immediately below the first electronic component, and the second surface of the wiring substrate is longer than a distance between an outer surface of the resin immediately above the second electronic component, and the first surface of the wiring substrate.

Abstract: A soldering device capable of shortening operation time of soldering and suppressing solder non-wetting is provided. A soldering device includes: a plurality of tubular solder piece guide tubes which have space therein for a solder piece supplied from a supply port to pass through; a first holding unit which holds the solder piece guide tubes; and a heating unit which heats the first holding unit. Tip end portions of the solder piece guide tubes on a soldering side are arranged on an inner side of the first holding unit.

Abstract: The objective of the present invention is to improve reliability in a solder connection portion between an electronic component and a wiring pattern. A pair of wiring patterns (31A and 31B) are formed on a circuit wiring board (30) with an insulation layer (37) therebetween. Each wiring pattern (31A and 31B) has a land (33a or 33b) and a wiring portion (34a or 34b) that is narrower than the land. By way of solder (42), a chip component (41) is soldered to the lands (33a and 33b). The x (width) direction center (Xa) of each connection portion (53) where a respective wiring portion (34a or 34b) is connected to a respective land (33a or 33b) is disposed at a position that is outside of both the region in which a region of predetermined width (Wc) of the chip component (41) extends in the x (longitudinal) direction, and the region in which a region of predetermined length (Lc) of the chip component (41) extends in a y (transverse) direction.

Abstract: The objective of the present invention is to improve reliability in a solder connection portion between an electronic component and a wiring pattern. A pair of wiring patterns (31A and 31B) are formed on a circuit wiring board (30) with an insulation layer (37) therebetween. Each wiring pattern (31A and 31B) has a land (33a or 33b) and a wiring portion (34a or 34b) that is narrower than the land. By way of solder (42), a chip component (41) is soldered to the lands (33a and 33b). The x (width) direction center (Xa) of each connection portion (53) where a respective wiring portion (34a or 34b) is connected to a respective land (33a or 33b) is disposed at a position that is outside of both the region in which a region of predetermined width (Wc) of the chip component (41) extends in the x (longitudinal) direction, and the region in which a region of predetermined length (Lc) of the chip component (41) extends in a y (transverse) direction.

Abstract: The present invention is directed to methods and compositions for improving pulmonary surfactant catabolism. More specifically, the specification describes methods and compositions for making and using a lysosomal phospholipase A2 in methods for the diagnosis, and treatment of disorders of phospholipid catabolism such as pulmonary alveolar proteinosis.

Abstract: The present invention is directed to methods and compositions for improving pulmonary surfactant catabolism. More specifically, the specification describes methods and compositions for making and using a lysosomal phospholipase A2 in methods for the diagnosis, and treatment of disorders of phospholipid catabolism such as pulmonary alveolar proteinosis.

Abstract: The present invention is directed to methods and compositions for improving pulmonary surfactant catabolism. More specifically, the specification describes methods and compositions for making and using a lysosomal phospholipase A2 in methods for the diagnosis, and treatment of disorders of phospholipid catabolism such as pulmonary alveolar proteinosis.

Abstract: The present invention is directed to methods and compositions for improving pulmonary surfactant catabolism. More specifically, the specification describes methods and compositions for making and using a lysosomal phospholipase A2 in methods for the diagnosis, and treatment of disorders of phospholipid catabolism such as pulmonary alveolar proteinosis.

Abstract: Remedies for uveitis which contain, as the active ingredient, one or more compounds represented by the following general formula (I) or salts thereof: ##STR1## wherein R.sub.1 represents a member selected from the group consisting of CH.sub.2, CH.sub.2 CH.sub.2, CH.sub.2 O, CH.sub.2 S and CH.sub.2 SO; R.sub.2 represents a hydrogen atom, a lower alkyl group having 1 to 4 carbon atoms or a benzyl group; R.sub.3 represents a group of the general formula COOR.sub.4 (wherein R.sub.4 represents a hydrogen atom or a lower alkyl group having 1 to 4 carbon atoms), a group of the general formula NHCOR.sub.5 (wherein R.sub.5 represents an optionally substituted phenyl group), a group of the general formula CONR.sub.6 R.sub.7 (wherein R.sub.6 represents a hydrogen atom or a lower alkyl group having 1 to 4 carbon atoms; and R.sub.7 represents a lower alkyl group having 1 to 4 carbon atoms, an optionally substituted phenyl group, a carboxyalkyl group or a lower alkylsulfonyl group), a PO.sub.3 H.sub.2 group or an SO.sub.