Patents by Inventor Miki IIDA

Miki IIDA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240166689
    Abstract: An object of the present invention is to provide methods of discovering drugs effective for tough targets, which have conventionally been discovered only with difficulty. The present invention relates to novel methods for cyclizing peptide compounds, and novel peptide compounds and libraries comprising the same, to achieve the above object.
    Type: Application
    Filed: September 1, 2023
    Publication date: May 23, 2024
    Inventors: Shiori KARIYUKI, Takeo IIDA, Miki KOJIMA, Ryuichi TAKEYAMA, Mikimasa TANADA, Tetsuo KOJIMA, Hitoshi IIKURA, Atsushi MATSUO, Takuya SHIRAISHI, Takashi EMURA, Kazuhiko NAKANO, Koji TAKANO, Kousuke ASOU, Takuya TORIZAWA, Ryusuke TAKANO, Nozomi HISADA, Naoaki MURAO, Atsushi OHTA, Kaori KIMURA, Yusuke YAMAGISHI, Tatsuya KATO
  • Patent number: 9714170
    Abstract: A filler that can suppress thermal expansion of a glass composition with a small amount thereof added and is also excellent in terms of flowability when the glass composition is melted, and a glass composition containing the filler are provided. There is also provided a process for producing a hexagonal phosphate-based compound that can be suitably used as the filler using a simple, industrially advantageous method. The filler of the present invention contains a hexagonal phosphate-based compound that has a purity of 90% or higher and is represented by the following Formula 1, the filler having a content of an ionic compound that is no greater than 1.0 wt %, KaZrb(PO4)3??(1) wherein, in Formula 1, a is a positive number of from 0.8 to 1.2 and b is a positive number satisfying a+4b=9.
    Type: Grant
    Filed: November 13, 2014
    Date of Patent: July 25, 2017
    Assignee: TOAGOSEI CO., LTD.
    Inventors: Miki Iida, Yasuharu Ono
  • Publication number: 20160289076
    Abstract: A filler that can suppress thermal expansion of a glass composition with a small amount thereof added and is also excellent in terms of flowability when the glass composition is melted, and a glass composition containing the filler are provided. There is also provided a process for producing a hexagonal phosphate-based compound that can be suitably used as the filler using a simple, industrially advantageous method. The filler of the present invention contains a hexagonal phosphate-based compound that has a purity of 90% or higher and is represented by the following Formula 1, the filler having a content of an ionic compound that is no greater than 1.0 wt %, KaZrb(PO4)3 ??(1) wherein, in Formula 1, a is a positive number of from 0.8 to 1.2 and b is a positive number satisfying a+4b=9.
    Type: Application
    Filed: November 13, 2014
    Publication date: October 6, 2016
    Applicant: TOAGOSEI CO., LTD.
    Inventors: Miki IIDA, Yasuharu ONO