Patents by Inventor Miki Inaoka

Miki Inaoka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8440103
    Abstract: It is an object of the present invention to provide a binder resin composition usable for an inorganic fine particle-dispersed paste composition which is excellent in thixotropy and storage stability, has scarcely changeable screen printability with the lapse of time, and can be fired at a low temperature, and to provide the inorganic fine particle-dispersed paste composition. The present invention is directed to a binder resin composition, which contains a binder comprising a (meth)acrylic resin, an organic compound having 3 or more hydroxyl groups, and an organic solvent, the content of the organic compound having 3 or more hydroxyl groups being 0.1 to 15 parts by weight to 100 parts by weight of the (meth)acrylic resin.
    Type: Grant
    Filed: December 20, 2005
    Date of Patent: May 14, 2013
    Assignee: Sekisui Chemical Co., Ltd.
    Inventors: Hiroji Fukui, Shigeru Nomura, Takamaro Kakehi, Kenji Yamauchi, Takahiro Oomura, Miki Inaoka
  • Publication number: 20120178841
    Abstract: The present invention is a directed to a method of producing a thermally decomposing resin particle, which comprises polymerizing a polyoxyalkylene macromonomer having a functional group alone or in combination with another polymerizable monomer in a solvent.
    Type: Application
    Filed: February 9, 2012
    Publication date: July 12, 2012
    Inventors: Takahiro Oomura, Naoyuki Nagatani, Miki Inaoka, Hiroshi Yamauchi
  • Patent number: 8138252
    Abstract: It is an object of the present invention to provide a thermally disappearing resin particle and a thermally disappearing hollow resin particle which can be decomposed at a low temperature in a short time and do not cause deformation or cracking of a sintered body to be obtained in the case of using as a binder for a ceramic or a lightening material; a method of producing the thermally disappearing hollow resin particle; a ceramic composition which can be degreased and fired at a low temperature in a short time and gives a molded body with a high porosity without deformation or cracking even in the case a large quantity of a pore-forming material is used; and a method of producing a porous ceramic filter. The present invention is directed to a thermally disappearing resin particle, which contains a polyoxyalkylene resin, and 10% by weight or more of the whole particle disappearing within an hour by heating at a prescribed temperature in a range from 100 to 300° C.
    Type: Grant
    Filed: December 13, 2005
    Date of Patent: March 20, 2012
    Assignee: Sekisui Chemical Co., Ltd.
    Inventors: Takahiro Oomura, Naoyuki Nagatani, Miki Inaoka, Hiroshi Yamauchi
  • Publication number: 20090050850
    Abstract: It is an object of the present invention to provide a binder resin composition usable for an inorganic fine particle-dispersed paste composition which is excellent in thixotropy and storage stability, has scarcely changeable screen printability with the lapse of time, and can be fired at a low temperature, and to provide the inorganic fine particle-dispersed paste composition. The present invention is directed to a binder resin composition, which contains a binder comprising a (meth)acrylic resin, an organic compound having 3 or more hydroxyl groups, and an organic solvent, the content of the organic compound having 3 or more hydroxyl groups being 0.1 to 15 parts by weight to 100 parts by weight of the (meth)acrylic resin.
    Type: Application
    Filed: December 20, 2005
    Publication date: February 26, 2009
    Inventors: Hiroji Fukui, Shigeru Nomura, Takamaro Kakehi, Kenji Yamauchi, Takahiro Oomura, Miki Inaoka
  • Publication number: 20090035523
    Abstract: A member having high non-electrostatic properties and high hydrophilicity and preventing an adhesion of contaminants, a surface-treating process and an apparatus for the surface-treating process are provided. A surface-treatment apparatus comprises a water vapor-generating unit 1, a superheating unit 5 for superheating a water vapor to generate a superheated water vapor, and a processing unit 11 for spraying the superheated water vapor to a member 14 to be treated (a ceramic, a metal) or for exposing the member to the superheated water vapor. Treating the untreated member with a superheated water vapor having a temperature 300 to 1000° C., hydrophilicity and antistatic properties are imparted to the member. The untreated member may be a member (a window member) contacting with a processing space in a vapor phase surface process apparatus (e.g., a chamber) for the surface process of a substrate by a vapor phase method such as a PVD, a CVD, or a dry etching.
    Type: Application
    Filed: June 15, 2006
    Publication date: February 5, 2009
    Applicants: Asahi Tech Co., Ltd., SEKISUI CHEMICAL CO., LTD.
    Inventors: Koichiro Takayanagi, Shigeru Nomura, Takamaro Kakehi, Kenji Yamauchi, Takahiro Oomura, Miki Inaoka
  • Publication number: 20080269394
    Abstract: It is an object of the present invention to provide a thermally disappearing resin particle and a thermally disappearing hollow resin particle which can be decomposed at a low temperature in a short time and do not cause deformation or cracking of a sintered body to be obtained in the case of using as a binder for a ceramic or a lightening material; a method of producing the thermally disappearing hollow resin particle; a ceramic composition which can be degreased and fired at a low temperature in a short time and gives a molded body with a high porosity without deformation or cracking even in the case a large quantity of a pore-forming material is used; and a method of producing a porous ceramic filter. The present invention is directed to a thermally disappearing resin particle, which contains a polyoxyalkylene resin, and 10% by weight or more of the whole particle disappearing within an hour by heating at a prescribed temperature in a range from 100 to 300° C.
    Type: Application
    Filed: December 13, 2005
    Publication date: October 30, 2008
    Applicant: Sekisui Chemical Co., Ltd.
    Inventors: Takahiro Oomura, Naoyuki Nagatani, Miki Inaoka, Hiroshi Yamauchi