Patents by Inventor Miki KASHIWA

Miki KASHIWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10373724
    Abstract: A power cable may include a first plurality of copper alloy wires having a first percentage of strengthening alloying material and a second plurality of copper alloy wires having a second percentage of strengthening alloying material. One or more of the second plurality of copper alloy wires may abut one or more of the first plurality of copper alloy wires. The second percentage of strengthening alloying material may be different than the first percentage of strengthening alloying material. Computing devices using power cables are also described.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: August 6, 2019
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Ivan Andrew McCracken, Joel James Schmelzle, Miki Kashiwa
  • Publication number: 20190221326
    Abstract: A power cable may include a first plurality of copper alloy wires having a first percentage of strengthening alloying material and a second plurality of copper alloy wires having a second percentage of strengthening alloying material. One or more of the second plurality of copper alloy wires may abut one or more of the first plurality of copper alloy wires. The second percentage of strengthening alloying material may be different than the first percentage of strengthening alloying material. Computing devices using power cables are also described.
    Type: Application
    Filed: January 12, 2018
    Publication date: July 18, 2019
    Inventors: Ivan Andrew MCCRACKEN, Joel James SCHMELZLE, Miki KASHIWA