Abstract: To provide a conductive paste that exhibits a high thermal conductivity (a low thermal resistance) after adhesion and hardening and that enables an adhesive layer to be formed thin and to provide an electronic part that has an excellent radiating capability and that enables the thickness of films to be reduced. A conductive paste containing conductive particles, a hardenable resin, and a solvent has mixed therein fine spherical conductive particles such as Ag particles, the particle size is on the order of 0.05 to 1 &mgr;m, smaller than the first conductive particles. This conductive paste is used to mount an electronic part such as a semiconductor chip in producing a semiconductor package.