Patents by Inventor Miki Shibata

Miki Shibata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Film thickness measuring method and measuring apparatus for organic thin film for use in organic electroluminesce device
    Patent number: 6992781
    Abstract: A method for measuring a relative thickness distribution of an organic thin film for use in an organic electroluminescence device comprises the steps of irradiating a predetermined region of the organic thin film with a light including an ultraviolet light, measuring the intensity of a fluorescence produced by the organic thin film in response to the light irradiation, and obtaining a film thickness of the predetermined region from the intensity of the fluorescence. Further, an apparatus for measuring a thickness distribution for use in an organic electroluminescence device has means for irradiating a predetermined region of the organic thin film with a light including an ultraviolet light, means for measuring the intensity of a fluorescence produced by the organic thin film, and means for obtaining the film thickness of the predetermined region from the intensity of the fluorescence.
    Type: Grant
    Filed: March 18, 2003
    Date of Patent: January 31, 2006
    Assignee: President of Toyama University
    Inventors: Hiroyuki Okada, Miki Shibata, Tadahiro Echigo, Shigeki Naka, Hiroyoshi Onnagawa
  • Film thickness measuring method and measuring apparatus for organic thin film for use in organic electroluminesce device
    Publication number: 20030193672
    Abstract: A method for measuring a relative thickness distribution of an organic thin film for use in an organic electroluminescence device comprises the steps of irradiating a predetermined region of the organic thin film with a light including an ultraviolet light, measuring the intensity of a fluorescence produced by the organic thin film in response to the light irradiation, and obtaining a film thickness of the predetermined region from the intensity of the fluorescence. Further, an apparatus for measuring a thickness distribution for use in an organic electroluminescence device has means for irradiating a predetermined region of the organic thin film with a light including an ultraviolet light, means for measuring the intensity of a fluorescence produced by the organic thin film, and means for obtaining the film thickness of the predetermined region from the intensity of the fluorescence.
    Type: Application
    Filed: March 18, 2003
    Publication date: October 16, 2003
    Inventors: Hiroyuki Okada, Miki Shibata, Tadahiro Echigo, Shigeki Naka, Hiroyoshi Onnagawa
  • Polishing apparatus
    Patent number: 6074276
    Abstract: A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing section for polishing a surface of a workpiece, a cleaning section for cleaning the workpiece which has been polished, a first liquid leakage sensor provided in the polishing section for detecting a liquid leakage which occurs in the polishing section, and a second liquid leakage sensor provided in the cleaning section for detecting a liquid leakage which occurs in the cleaning section. The polishing apparatus further includes a controlling device for stopping the supply of liquid to the polishing section or the cleaning section in which the liquid leakage occurs when either one of the first and second liquid leakage sensors detects the liquid leakage.
    Type: Grant
    Filed: December 18, 1998
    Date of Patent: June 13, 2000
    Assignee: Ebara Corporation
    Inventors: Miki Shibata, Toyomi Nishi, Hidetaka Nakao, Tetsuji Togawa
  • Polishing apparatus
    Patent number: 5885134
    Abstract: A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing section for polishing a surface of a workpiece, a cleaning section for cleaning the workpiece which has been polished, a first liquid leakage sensor provided in the polishing section for detecting a liquid leakage which occurs in the polishing section, and a second liquid leakage sensor provided in the cleaning section for detecting a liquid leakage which occurs in the cleaning section. The polishing apparatus further includes a controlling device for stopping the supply of liquid to the polishing section or the cleaning section in which the liquid leakage occurs when either one of the first and second liquid leakage sensors detects the liquid leakage.
    Type: Grant
    Filed: April 16, 1997
    Date of Patent: March 23, 1999
    Assignee: Ebara Corporation
    Inventors: Miki Shibata, Toyomi Nishi, Hidetaka Nakao, Tetsuji Togawa
  • Polishing apparatus
    Patent number: RE38215
    Abstract: A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing section for polishing a surface of a workpiece, a cleaning section for cleaning the workpiece which has been polished, a first liquid leakage sensor provided in the polishing section for detecting a liquid leakage which occurs in the polishing section, and a second liquid leakage sensor provided in the cleaning section for detecting a liquid leakage which occurs in the cleaning section. The polishing apparatus further includes a controlling device for stopping the supply of liquid to the polishing section or the cleaning section in which the liquid leakage occurs when either one of the first and second liquid leakage sensors detects the liquid leakage.
    Type: Grant
    Filed: March 22, 2001
    Date of Patent: August 12, 2003
    Assignee: Ebara Corporation
    Inventors: Miki Shibata, Toyomi Nishi, Hidetaka Nakao, Tetsuji Togawa