Patents by Inventor Miki Stravets

Miki Stravets has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10790608
    Abstract: Apparatuses, systems, and associated methods of manufacturing are described that provide a retention clip for securing a cable connection to a printed circuit board (PCB). An example retention clip includes a bottom support member, a top support member, and a hinge element attached to the top support member and the bottom support member. The hinge element allows movement of the retention clip between a locked position and an unlocked position. The retention clip further defines an opening configured to receive one or more cable connections therethrough. In the locked position, the top support member is folded about the hinge element so as to engage the bottom support member and secure the cable connection disposed within the opening to the PCB.
    Type: Grant
    Filed: November 13, 2018
    Date of Patent: September 29, 2020
    Assignee: MELLANOX TECHNOLOGIES, LTD.
    Inventors: Andrey Blyahman, Yossi Nachum, Miki Stravets
  • Publication number: 20200153164
    Abstract: Apparatuses, systems, and associated methods of manufacturing are described that provide a retention clip for securing a cable connection to a printed circuit board (PCB). An example retention clip includes a bottom support member, a top support member, and a hinge element attached to the top support member and the bottom support member. The hinge element allows movement of the retention clip between a locked position and an unlocked position. The retention clip further defines an opening configured to receive one or more cable connections therethrough. In the locked position, the top support member is folded about the hinge element so as to engage the bottom support member and secure the cable connection disposed within the opening to the PCB.
    Type: Application
    Filed: November 13, 2018
    Publication date: May 14, 2020
    Inventors: Andrey BLYAHMAN, Yossi NACHUM, Miki STRAVETS
  • Publication number: 20180139871
    Abstract: A power supply module for facilitating an increased flow of cooling air comprises a chassis in which circuitry of the power supply module is housed, and a front panel associated with the chassis. The power supply module is configured with one or more airflow openings which facilitate a flow of cooling air into or out of a chassis interior and which are ensured of remaining unblocked, wherein one of the chassis and the front panel is formed with one or more inclined surfaces to define at least a part of a corresponding passageway through which air crossing a portion of the front panel is flowable. The one or more inclined surfaces is apertured to define the one or more airflow openings or an aperture in fluid communication with the one or more airflow openings.
    Type: Application
    Filed: February 14, 2017
    Publication date: May 17, 2018
    Applicant: TDK-LAMBDA LTD
    Inventors: Miki Stravets, George Rucareanu
  • Patent number: D813163
    Type: Grant
    Filed: December 29, 2016
    Date of Patent: March 20, 2018
    Assignee: TDK-Lambda Limited
    Inventors: Miki Stravets, George Rucareanu
  • Patent number: D837153
    Type: Grant
    Filed: December 29, 2016
    Date of Patent: January 1, 2019
    Assignee: TDK-Lambda Limited
    Inventors: Miki Stravets, George Rucareanu
  • Patent number: D837154
    Type: Grant
    Filed: December 29, 2016
    Date of Patent: January 1, 2019
    Assignee: TDK-Lambda Limited
    Inventors: Miki Stravets, George Rucareanu
  • Patent number: D877074
    Type: Grant
    Filed: July 3, 2017
    Date of Patent: March 3, 2020
    Assignee: TDK-Lambda Limited
    Inventors: Miki Stravets, George Rucareanu