Patents by Inventor Miki TOSHIMA

Miki TOSHIMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11031306
    Abstract: According to one embodiment, a quality control method of a position measurement light source includes irradiating light of the position measurement light source on a plurality of marks having different heights and measuring a relationship between the height of the mark and an intensity of light reflected by the mark. The quality control method includes identifying a wavelength of the position measurement light source by comparing measurement data acquired by the measuring to reference data of a relationship between the height of the mark and an intensity of reflected light for each of a plurality of wavelengths.
    Type: Grant
    Filed: September 11, 2018
    Date of Patent: June 8, 2021
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventors: Miki Toshima, Sadatoshi Murakami
  • Publication number: 20210043488
    Abstract: An alignment apparatus according to one embodiment, includes: a first and a second stage; a first and a second detector; a first and a second moving mechanism; and a controller. The first and second stages are configured to respectively hold a first and a second semiconductor substrate on which a first and a second alignment mark are respectively disposed. The first and second moving mechanisms are configured to respectively move the first and second stages relatively to each other. The controller is configured to perform the following (a), (b). (a) The controller control the detectors and the moving mechanisms to cause the first detector to detect the second alignment mark and to cause the second detector to detect the first alignment mark. (b) The controller calculate a position deviation between the substrates in accordance with results of the detections.
    Type: Application
    Filed: March 6, 2020
    Publication date: February 11, 2021
    Applicant: Kioxia Corporation
    Inventors: Miki TOSHIMA, Osamu YAMANE
  • Patent number: 10599056
    Abstract: According to one embodiment, in a position measuring method, alignment measurement in a light exposure process is executed by irradiating a first mark with light having a wavelength of ?1, with respect to a processing object that includes a first layer and a second layer stacked above a substrate and a resist applied on the second layer. The first mark is provided in the first layer and includes a plurality of segments arranged at a pitch smaller than a resolution limit given by light having the wavelength of ?1. Then, overlay measurement is executed by irradiating the first mark and a second mark with light having a wavelength of ?2 shorter than the wavelength of ?1. The second mark has been formed by performing a light exposure and development process to the resist, and includes a plurality of segments arranged at the pitch.
    Type: Grant
    Filed: January 31, 2019
    Date of Patent: March 24, 2020
    Assignee: Toshiba Memory Corporation
    Inventors: Miki Toshima, Osamu Yamane, Yosuke Okamoto
  • Publication number: 20200081357
    Abstract: According to one embodiment, in a position measuring method, alignment measurement in a light exposure process is executed by irradiating a first mark with light having a wavelength of ?1, with respect to a processing object that includes a first layer and a second layer stacked above a substrate and a resist applied on the second layer. The first mark is provided in the first layer and includes a plurality of segments arranged at a pitch smaller than a resolution limit given by light having the wavelength of ?1. Then, overlay measurement is executed by irradiating the first mark and a second mark with light having a wavelength of ?2 shorter than the wavelength of ?1. The second mark has been formed by performing a light exposure and development process to the resist, and includes a plurality of segments arranged at the pitch.
    Type: Application
    Filed: January 31, 2019
    Publication date: March 12, 2020
    Applicant: Toshiba Memory Corporation
    Inventors: Miki Toshima, Osamu Yamane, Yosuke Okamoto
  • Publication number: 20190295902
    Abstract: According to one embodiment, a quality control method of a position measurement light source includes irradiating light of the position measurement light source on a plurality of marks having different heights and measuring a relationship between the height of the mark and an intensity of light reflected by the mark. The quality control method includes identifying a wavelength of the position measurement light source by comparing measurement data acquired by the measuring to reference data of a relationship between the height of the mark and an intensity of reflected light for each of a plurality of wavelengths.
    Type: Application
    Filed: September 11, 2018
    Publication date: September 26, 2019
    Applicant: Toshiba Memory Corporation
    Inventors: Miki Toshima, Sadatoshi Murakami
  • Patent number: 10295409
    Abstract: According to one embodiment, a value of a film thickness of a processing object disposed above a substrate is obtained. Then, a wavelength that provides a highest degree of intensity of signal light reflected when the signal light is incident onto the processing object having the value of the film thickness, based on wavelength selection reference information is selected. Then, a first instruction performing an alignment process to the substrate by use of signal light having a wavelength thus selected is generated. The wavelength selection reference information is information that includes a correlation between values of the film thickness of the processing object and degrees of intensity of the signal light, with respect to a plurality of wavelengths.
    Type: Grant
    Filed: June 1, 2016
    Date of Patent: May 21, 2019
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventors: Miki Toshima, Satoshi Usui, Manabu Takakuwa, Nobuhiro Komine, Takaki Hashimoto
  • Publication number: 20170235232
    Abstract: According to one embodiment, a value of a film thickness of a processing object disposed above a substrate is obtained. Then, a wavelength that provides a highest degree of intensity of signal light reflected when the signal light is incident onto the processing object having the value of the film thickness, based on wavelength selection reference information is selected. Then, a first instruction performing an alignment process to the substrate by use of signal light having a wavelength thus selected is generated. The wavelength selection reference information is information that includes a correlation between values of the film thickness of the processing object and degrees of intensity of the signal light, with respect to a plurality of wavelengths.
    Type: Application
    Filed: June 1, 2016
    Publication date: August 17, 2017
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Miki TOSHIMA, Satoshi USUI, Manabu TAKAKUWA, Nobuhiro KOMINE, Takaki HASHIMOTO